ADP1706/ADP1707/ADP1708
OUTLINE DIMENSIONS
5.00 (0.197)
4.90 (0.193)
4.80 (0.189)
3.098 (0.122)
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
2.41 (0.095)
8
5
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
TOP VIEW
1
4
BOTTOM VIEW
(PINS UP)
1.27 (0.05)
BSC
0.50 (0.020)
0.25 (0.010)
45°
1.65 (0.065)
1.25 (0.049)
1.75 (0.069)
1.35 (0.053)
1.27 (0.050)
0.40 (0.016)
0.10 (0.004)
MAX
SEATING
PLANE
8°
0°
0.25 (0.0098)
0.17 (0.0067)
0.51 (0.020)
0.31 (0.012)
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETER; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 43. 8-Lead Standard Small Outline Package, with Expose Pad [SOIC_N_EP]
Narrow Body
(RD-8-2)
Dimensions shown in millimeters and (inches)
3.25
3.00 SQ
2.75
0.60 MAX
0.50
BSC
0.60 MAX
5
8
2.95
2.75 SQ
2.55
1.60
1.45
1.30
EXPOSED
PAD
TOP
VIEW
PIN 1
INDICATOR
(BOTTOM VIEW)
4
1
PIN 1
INDICATOR
0.50
0.40
0.30
1.89
1.74
1.59
12° MAX
0.70 MAX
0.65TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
Figure 44. 8-Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
Rev. 0 | Page 16 of 20