Data Sheet
ADP165/ADP166
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP165/ADP166 limit current so that only
320 mA is conducted into the short.
Table 10. Typical θJA Values
θJA (°C/W)
Copper Size (mm2)
TSOT
170
152
146
134
131
LFCSP
175.1
135.6
77.3
WLCSP
260
159
01
If self-heating of the junction temperature is great enough to
cause its temperature to rise above 150°C, thermal shutdown
activates, turning off the output and reducing the output current
to zero. As the junction temperature cools and drops below 135°C,
the output turns on and conducts 320 mA into the short, again
causing the junction temperature to rise above 150°C. This thermal
oscillation between 135°C and 150°C causes a current oscillation
between 320 mA and 0 mA that continues as long as the short
remains at the output.
50
100
300
500
157
65.2
153
51
151
1 Device soldered to minimum size pin traces.
Table 11. Typical ΨJB Values
Package
ΨJB
Unit
5-Lead TSOT
6-Lead LFCSP
4-Ball WLCSP
42.8
17.9
58.4
(°C/W)
(°C/W)
(°C/W)
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so that junction temperatures do not exceed 125°C.
Calculate the junction temperature of the ADP165/ADP166
from the following equation:
THERMAL CONSIDERATIONS
In most applications, the ADP165/ADP166 do not dissipate
much heat due to their high efficiency. However, in applications
with high ambient temperature and high supply voltage to
output voltage differential, the heat dissipated in the package
is high enough that it can cause the junction temperature of
the die to exceed the maximum junction temperature of 125°C.
TJ = TA + (PD × θJA)
(2)
(3)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND
where:
IN and VOUT are input and output voltages, respectively.
LOAD is the load current.
GND is the ground current.
)
When the junction temperature exceeds 150°C, the converter enters
thermal shutdown. It recovers only after the junction temperature
has decreased below 135°C to prevent any permanent damage.
Therefore, thermal analysis for the chosen application is very
important to guarantee reliable performance over all conditions.
The junction temperature of the die is the sum of the ambient
temperature of the environment and the temperature rise of the
package due to the power dissipation, as shown in Equation 2.
V
I
I
Power dissipation due to ground current is quite small and can be
ignored. Therefore, the junction temperature equation simplifies to
the following:
TJ = TA + θJA[(VIN − VOUT) × ILOAD
]
(4)
To guarantee reliable operation, the junction temperature of the
ADP165/ADP166 must not exceed 125°C. To ensure that the
junction temperature stays below this maximum value, the user
must be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θJA). The θJA
number is dependent on the package assembly compounds that
are used and the amount of copper used to solder the package
GND pins to the PCB.
As shown in Equation 4, for a given ambient temperature, input-
to-output voltage differential, and continuous load current, there
exists a minimum copper size requirement for the PCB to ensure
the junction temperature does not rise above 125°C. Figure 43 to
Figure 57 show the junction temperature calculations for the
different ambient temperatures, load currents, VIN-to-VOUT
differentials, and areas of PCB copper.
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the junction
temperature rise (see Figure 55 to Figure 57). Maximum junction
temperature (TJ) is calculated from the board temperature (TB)
and power dissipation (PD) using the following formula:
Table 10 shows the typical θJA values of the 5-lead TSOT, 6-lead
LFCSP, and the 4-ball WLCSP for various PCB copper sizes.
Table 11 shows the typical ΨJB value of the 5-lead TSOT, 6-lead
LFCSP, and 4-ball WLCSP.
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 17.9°C/W for the 6-lead LFCSP package,
42.8°C/W for the 5-lead TSOT package, and 58.4°C/W for the
4-ball WLCSP package.
Rev. A | Page 17 of 23