ADL5724
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
θJA is thermal resistance, junction to ambient (°C/W), θJB is
thermal resistance, junction to board (°C/W), and θJC is thermal
resistance, junction to case (°C/W).
Parameter
Rating
Supply Voltages
VCC1
2.25 V
VCC2
4.1 V
150°C/W
−40°C to +85°C
−55°C to +125°C
−65°C to +150°C
Table 4. Thermal Resistance
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering, 60 sec)
1
1
1
Package Type
θJA
θJB
23.88
θJC
3.71
Unit
8-Lead LFCSP
39.90
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance for a printed circuit board (PCB) with 3 × 4 vias.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
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