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ADL5724-EVALZ PDF预览

ADL5724-EVALZ

更新时间: 2022-02-26 12:29:20
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
13页 431K
描述
Satellite communications

ADL5724-EVALZ 数据手册

 浏览型号ADL5724-EVALZ的Datasheet PDF文件第2页浏览型号ADL5724-EVALZ的Datasheet PDF文件第3页浏览型号ADL5724-EVALZ的Datasheet PDF文件第4页浏览型号ADL5724-EVALZ的Datasheet PDF文件第6页浏览型号ADL5724-EVALZ的Datasheet PDF文件第7页浏览型号ADL5724-EVALZ的Datasheet PDF文件第8页 
ADL5724  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
THERMAL RESISTANCE  
θJA is thermal resistance, junction to ambient (°C/W), θJB is  
thermal resistance, junction to board (°C/W), and θJC is thermal  
resistance, junction to case (°C/W).  
Parameter  
Rating  
Supply Voltages  
VCC1  
2.25 V  
VCC2  
4.1 V  
150°C/W  
−40°C to +85°C  
−55°C to +125°C  
−65°C to +150°C  
Table 4. Thermal Resistance  
Maximum Junction Temperature  
Operating Temperature Range  
Storage Temperature Range  
Lead Temperature Range (Soldering, 60 sec)  
1
1
1
Package Type  
θJA  
θJB  
23.88  
θJC  
3.71  
Unit  
8-Lead LFCSP  
39.90  
°C/W  
1 See JEDEC standard JESD51-2 for additional information on optimizing the  
thermal impedance for a printed circuit board (PCB) with 3 × 4 vias.  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
ESD CAUTION  
Rev. 0 | Page 4 of 12  
 
 
 

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