ADF4002
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
AVDD to GND1
Rating
–0.3 V to +3.6 V
–0.3 V to +0.3 V
–0.3 V to +5.8 V
–0.3 V to +5.8 V
–0.3 V to VDD + 0.3 V
–0.3 V to VP + 0.3 V
–0.3 V to VDD + 0.3 V
AVDD to DVDD
VP to GND
VP to AVDD
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REFIN, RFINA, RFINB to GND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
This device is a high performance RF integrated circuit with an
ESD rating of <2 kV, and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
–40°C to +85°C
–65°C to +125°C
150°C
THERMAL CHARACTERISTICS
Table 4. Thermal Impedance
215°C
220°C
Package Type
θJA
Unit
°C/W
°C/W
Transistor Count
TSSOP
LFCSP_VQ
150.4
122
CMOS
Bipolar
6425
303
1 GND = AGND = DGND = 0 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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