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ADD8708WCPZ-REEL7 PDF预览

ADD8708WCPZ-REEL7

更新时间： 2024-02-02 15:35:46
品牌 Logo 应用领域
亚德诺 - ADI 调节器缓冲放大器放大器电路
页数 文件大小 规格书
16页 743K
描述
18-Channel Gamma Buffer with Regulator

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中文翻译

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ADD8708WCPZ-REEL7 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：QFN
包装说明：HVQCCN,针数：48
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.84
Is Samacsys：N放大器类型：BUFFER
最大平均偏置电流 (IIB)：1.5 µA标称带宽 (3dB)：4.5 MHz
最大输入失调电压：15000 µVJESD-30 代码：R-XQCC-N48
JESD-609代码：e3长度：7 mm
湿度敏感等级：3功能数量：18
端子数量：48最高工作温度：105 °C
最低工作温度：-40 °C最小输出电流：0.15 A
封装主体材料：UNSPECIFIED封装代码：HVQCCN
封装形状：RECTANGULAR封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1 mm标称压摆率：6 V/us
供电电压上限：18 V标称供电电压 (Vsup)：16 V
表面贴装：YES温度等级：INDUSTRIAL
端子面层：MATTE TIN端子形式：NO LEAD
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：40宽度：7 mm
Base Number Matches：1

ADD8708WCPZ-REEL7 数据手册

 浏览型号ADD8708WCPZ-REEL7的Datasheet PDF文件第8页浏览型号ADD8708WCPZ-REEL7的Datasheet PDF文件第9页浏览型号ADD8708WCPZ-REEL7的Datasheet PDF文件第10页浏览型号ADD8708WCPZ-REEL7的Datasheet PDF文件第12页浏览型号ADD8708WCPZ-REEL7的Datasheet PDF文件第13页浏览型号ADD8708WCPZ-REEL7的Datasheet PDF文件第14页 
ADD8708  
VOLTAGE REGULATOR  
LAND PATTERN  
The on-board voltage regulator provides a regulated voltage to  
the resistor chain to provide stable gamma voltages.  
The LFCSP package comes with a thermal pad. Soldering down  
this thermal pad dramatically improves the heat dissipation of  
the package. It is necessary to attach vias that connect the  
soldered thermal pad to another layer on the board. This  
provides an avenue to dissipate the heat away from the part.  
Without vias, the heat is isolated directly under the part.  
The two mask-programmable internal resistors, R1 and R2,  
and a reference voltage set the output of the regulator. The  
typical values of these parts are shown in Figure 23. In addition,  
see the Tap Point and Regulator Voltage Request Form in this  
data sheet.  
Subdivide the solder paste, or stencil layer, for the thermal pad  
to reduce solder balling and splatter. It is not critical how the  
subdivisions are arranged, as long as the total coverage of the  
solder paste for the thermal pad is greater than 50%. The land  
pattern is critical to heat dissipation. A suggested land pattern is  
shown in Figure 22.  
R
2
55kΩ  
R
1
5kΩ  
V
REG OUT  
+
–
V
1.2V  
REF  
The thermal pad is attached to the substrate. In the ADD8708,  
the substrate is connected to VDD. To be electrically safe, the  
thermal pad should be soldered to an area on the board that is  
electrically isolated or connected to VDD. Attaching the thermal  
pad to ground adversely affects the performance of the part.  
Figure 23. Voltage Regulator  
The internal resistors have a typical accuracy of 0.1%. External  
resistors can be used to adjust the regulator voltage; however, it  
is not recommended. Please contact your local sales office for  
further details.  
MAXIMUM POWER DISSIPATION  
The maximum safe power dissipation in the ADD8708 package  
is limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, the glass transition tempera-  
ture, the properties of the plastic change. Even temporarily  
exceeding this temperature limit may change the stresses that  
the package exerts on the die, permanently shifting the para-  
metric performance of the ADD8708. Exceeding a junction  
temperature of 175°C for an extended period can result in  
changes in the silicon devices, potentially causing failure.  
Rev. 0 | Page 11 of 16  
 
 
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