ADC3563
SBAS990 – FEBRUARY 2021
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MIN
–0.3
–0.3
–0.3
–0.3
MAX
2.1
UNIT
V
Supply voltage range, AVDD, IOVDD
Supply voltage range, GND, IOGND, REFGND
0.3
V
AINP/M, CLKP/M, DCLKINP/M, VREF, REFBUF
PDN/SYNC, RESET, SCLK, SEN, SDIO
2.1
Voltage applied to
input pins
V
2.1
Junction temperature, TJ
Storage temperature, Tstg
105
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
2500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.75
1.75
–40
NOM
1.8
MAX UNIT
AVDD(1)
1.85
1.85
V
V
Supply
voltage range
IOVDD(1)
1.8
TA
TJ
Operating free-air temperature
Operating junction temperature
105
°C
°C
105(2)
(1) Measured to GND.
(2) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.
6.4 Thermal Information
ADC356x
RSB (QFN)
40 Pins
30.7
THERMAL METRIC(1)
UNIT
RΘJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RΘJC(top)
RΘJB
16.4
10.5
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ΨJB
10.5
RΘJC(bot)
2.0
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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