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ADA4857-1YRZ-R7 PDF预览

ADA4857-1YRZ-R7

更新时间: 2024-02-01 21:26:34
品牌 Logo 应用领域
亚德诺 - ADI 运算放大器放大器电路光电二极管
页数 文件大小 规格书
20页 588K
描述
Ultralow Distortion, Low Power, Low Noise, High Speed Op Amp

ADA4857-1YRZ-R7 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP,针数:8
Reach Compliance Code:unknown风险等级:5.35
Is Samacsys:N放大器类型:OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB):3.3 µA标称共模抑制比:86 dB
最大输入失调电压:4.5 µVJESD-30 代码:R-PDSO-G8
JESD-609代码:e3长度:4.9 mm
湿度敏感等级:1负供电电压上限:-5.5 V
标称负供电电压 (Vsup):-5 V功能数量:1
端子数量:8最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
座面最大高度:1.75 mm标称压摆率:2800 V/us
子类别:Operational Amplifier供电电压上限:5.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
温度等级:AUTOMOTIVE端子面层:MATTE TIN
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:3.9 mmBase Number Matches:1

ADA4857-1YRZ-R7 数据手册

 浏览型号ADA4857-1YRZ-R7的Datasheet PDF文件第3页浏览型号ADA4857-1YRZ-R7的Datasheet PDF文件第4页浏览型号ADA4857-1YRZ-R7的Datasheet PDF文件第5页浏览型号ADA4857-1YRZ-R7的Datasheet PDF文件第7页浏览型号ADA4857-1YRZ-R7的Datasheet PDF文件第8页浏览型号ADA4857-1YRZ-R7的Datasheet PDF文件第9页 
ADA4857-1/ADA4857-2  
ABSOLUTE MAXIMUM RATINGS  
The power dissipated in the package (PD) is the sum of the  
quiescent power dissipation and the power dissipated in the  
die due to the ADA4857 drive at the output. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS).  
Table 3.  
Parameter  
Rating  
Supply Voltage  
11 V  
Power Dissipation  
See Figure 4  
−VS + 0.7 V to +VS − 0.7 V  
VS  
Common-Mode Input Voltage  
Differential Input Voltage  
Exposed Paddle Voltage  
Storage Temperature Range  
Operating Temperature Range  
PD = Quiescent Power + (Total Drive Power Load Power)  
−VS  
2
VS VOUT  
VOUT  
RL  
PD =  
(
VS × IS  
)
+
×
−65°C to +125°C  
−40°C to +125°C  
2
RL  
Lead Temperature (Soldering, 10 sec) 300°C  
Junction Temperature 150°C  
RMS output voltages should be considered. If RL is referenced to  
−VS, as in single-supply operation, the total drive power is VS ×  
I
OUT. If the rms signal levels are indeterminate, consider the  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
worst case, when VOUT = VS/4 for RL to midsupply.  
2
(
VS/4  
RL  
)
PD =  
(
VS × IS +  
)
In single-supply operation with RL referenced to −VS, worst case  
is VOUT = VS/2.  
Airflow increases heat dissipation, effectively reducing θJA.  
In addition, more metal directly in contact with the package  
leads and exposed paddle from metal traces, through holes,  
ground, and power planes reduce θJA.  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, θJA is specified  
for device soldered in circuit board for surface-mount packages.  
Figure 4 shows the maximum safe power dissipation in the  
package vs. the ambient temperature for the SOIC and LFCSP  
packages on a JEDEC standard 4-layer board. θJA  
values are approximations.  
Table 4.  
Package Type  
θJA  
θJC  
15  
34.8  
19  
Unit  
°C/W  
°C/W  
°C/W  
8-Lead SOIC  
8-Lead LFCSP  
16-Lead LFSCP  
115  
94.5  
68.2  
3.0  
2.5  
2.0  
MAXIMUM POWER DISSIPATION  
The maximum safe power dissipation for the ADA4857 is  
limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the properties of the plastic change. Even temporarily  
exceeding this temperature limit may change the stresses that  
the package exerts on the die, permanently shifting the parametric  
performance of the ADA4857. Exceeding a junction temperature of  
175°C for an extended period can result in changes in silicon  
devices, potentially causing degradation or loss of functionality.  
ADA4857-2 (LFCSP)  
1.5  
1.0  
ADA4857-1 (LFCSP)  
0.5  
ADA4857-1 (SOIC)  
0
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90 100 110 120  
AMBIENT TEMPERATURE (°C)  
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board  
ESD CAUTION  
Rev. 0 | Page 6 of 20  
 
 

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