ADA4312-1
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
MAXIMUM POWER DISSIPATION
Parameter
Rating
Exceeding a junction temperature of 150°C can result in changes
to silicon devices, potentially causing degradation or loss of
functionality.
Supply Voltage, VCC
13.2 V
SD Voltage
VCC
Power Dissipation
1.25 W
The power dissipation of the ADA4312-1 is 750 mW for a typical
G.hn application delivering 16 dBm into a 40 Ω differential load.
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
−65°C to +125°C
−40°C to +85°C
300°C
The maximum internal power dissipation should not exceed
1.25 W over the extended industrial temperature range of −40°C
to +85°C on a PCB designed according to the guidelines in the
Thermal Management section.
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
THERMAL RESISTANCE
The thermal resistance (θJA) was specified using the ADA4312-1
evaluation board (EVAL-ADA4312-1ACPZ).
Table 3.
Package Type
θJA
Unit
16-Lead LFCSP
31.8
°C/W
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