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ADA4311-1ARHZ-RL PDF预览

ADA4311-1ARHZ-RL

更新时间： 2024-02-23 04:02:28
品牌 Logo 应用领域
亚德诺 - ADI 驱动器
页数 文件大小 规格书
16页 343K
描述
Low Cost, Dual, High Current Output Line Driver with Shutdown

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ADA4311-1ARHZ-RL 技术参数

是否无铅：含铅是否Rohs认证：符合
生命周期：Obsolete零件包装代码：TSSOP
包装说明：HTSSOP, TSSOP10,.19,20针数：10
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01风险等级：5.4
Is Samacsys：N放大器类型：OPERATIONAL AMPLIFIER
架构：CURRENT-FEEDBACK25C 时的最大偏置电流 (IIB)：9.5 µA
标称共模抑制比：62 dB频率补偿：YES
最大输入失调电压：3000 µVJESD-30 代码：S-PDSO-G10
JESD-609代码：e3长度：3 mm
低-失调：NO湿度敏感等级：3
功能数量：1端子数量：10
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：HTSSOP
封装等效代码：TSSOP10,.19,20封装形状：SQUARE
封装形式：SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：260电源：12 V
认证状态：Not Qualified座面最大高度：1.1 mm
标称压摆率：1050 V/us子类别：Operational Amplifier
最大压摆率：26 mA供电电压上限：13.6 V
标称供电电压 (Vsup)：12 V表面贴装：YES
技术：BIPOLAR温度等级：INDUSTRIAL
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子节距：0.5 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽带：YES
宽度：3 mmBase Number Matches：1

ADA4311-1ARHZ-RL 数据手册

 浏览型号ADA4311-1ARHZ-RL的Datasheet PDF文件第2页浏览型号ADA4311-1ARHZ-RL的Datasheet PDF文件第3页浏览型号ADA4311-1ARHZ-RL的Datasheet PDF文件第4页浏览型号ADA4311-1ARHZ-RL的Datasheet PDF文件第6页浏览型号ADA4311-1ARHZ-RL的Datasheet PDF文件第7页浏览型号ADA4311-1ARHZ-RL的Datasheet PDF文件第8页 
ADA4311-1  
ABSOLUTE MAXIMUM RATINGS  
Maximum Power Dissipation  
Table 2.  
The maximum safe power dissipation for the ADA4311-1 is  
limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the plastic changes its properties. Even temporarily  
exceeding this temperature limit can change the stresses that the  
package exerts on the die, permanently shifting the parametric  
performance of the amplifiers. Exceeding a junction temperature of  
150°C for an extended period can result in changes in silicon  
devices, potentially causing degradation or loss of functionality.  
Parameter  
Rating  
Supply Voltage  
Power Dissipation  
Storage Temperature Range  
Operating Temperature Range  
Lead Temperature (Soldering 10 sec)  
Junction Temperature  
13.6 V  
(TJMAX − TA)/θJA  
−65°C to +125°C  
−40°C to +85°C  
300°C  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress rating  
only; functional operation of the device at these or any other  
conditions above those indicated in the operational section of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
Figure 3 shows the maximum safe power dissipation in  
the package vs. the ambient temperature for the 10-lead  
MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board.  
θJA values are approximations.  
5.0  
THERMAL RESISTANCE  
4.5  
4.0  
3.5  
Thermal resistance (θJA) is specified for the worst-case conditions,  
that is, θJA is specified for device soldered in circuit board for  
surface-mount packages.  
MINI_SO_EP-10  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
Table 3.  
Package Type  
θJA  
Unit  
10-Lead MINI_SO_EP  
44  
°C/W  
–35  
–15  
5
25  
45  
65  
85  
AMBIENT TEMPERATURE (°C)  
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board  
ESD CAUTION  
Rev. 0 | Page 5 of 16  
 
 
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