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AD9432BSQZ-80 PDF预览

AD9432BSQZ-80

更新时间： 2024-01-09 21:08:01
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
16页 517K
描述
12-Bit, 80 MSPS/105 MSPS ADC

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AD9432BSQZ-80 数据手册

 浏览型号AD9432BSQZ-80的Datasheet PDF文件第4页浏览型号AD9432BSQZ-80的Datasheet PDF文件第5页浏览型号AD9432BSQZ-80的Datasheet PDF文件第6页浏览型号AD9432BSQZ-80的Datasheet PDF文件第8页浏览型号AD9432BSQZ-80的Datasheet PDF文件第9页浏览型号AD9432BSQZ-80的Datasheet PDF文件第10页 
AD9432  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
52 51 50 49 48 47 46 45 44 43 42 41 40  
52 51 50 49 48  
46 45 44 43 42 41 40  
47  
1
2
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
GND  
GND  
GND  
PIN 1  
V
1
2
CC  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
GND  
GND  
GND  
PIN 1  
3
GND  
GND  
V
V
CC  
CC  
V
CC  
4
3
GND  
GND  
V
V
CC  
CC  
5
V
GND  
GND  
GND  
4
CC  
AD9432  
TOP VIEW  
(Not to Scale)  
6
V
CC  
5
V
V
GND  
GND  
GND  
CC  
AD9432  
TOP VIEW  
7
ENCODE  
ENCODE  
GND  
6
CC  
8
V
(Not to Scale)  
DD  
7
ENCODE  
ENCODE  
GND  
9
DGND  
D0 (LSB)  
D1  
8
V
DD  
10  
11  
12  
13  
V
CC  
9
DGND  
D0 (LSB)  
D1  
GND  
10  
11  
12  
13  
V
CC  
DGND  
D2  
GND  
V
D3  
DD  
DGND  
D2  
V
D3  
DD  
14 15 16 17 18 19 20 21 22 23 24 25 26  
14 15 16 17 18 19 20 21 22 23 24 25 26  
NOTES  
1. ALTHOUGH NOT REQUIRED IN ALL APPLICATIONS, THE EXPOSED PADDLE  
ON THE UNDERSIDE OF THE PACKAGE SHOULD BE SOLDERED TO THE  
GROUND PLANE. SOLDERING THE EXPOSED PADDLE TO THE PCB  
INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING  
THE THERMAL CAPABILITY OF THE PACKAGE.  
NOTES  
1. DNC = DO NOT CONNECT.  
Figure 3. Pin Configuration, LQFP  
Figure 4. Pin Configuration, TQFP_EP  
Table 4. Pin Function Descriptions  
Pin No.  
Mnemonic  
Description  
1, 3, 4, 9, 11, 33,  
34, 35, 38, 39, 40,  
43, 48, 51  
GND  
Analog Ground.  
2, 5, 6, 10, 36, 37,  
42, 44, 47, 52  
VCC  
Analog Supply (5 V).  
7
ENCODE  
ENCODE  
DGND  
VDD  
Encode Clock for ADC, Complementary.  
Encode Clock for ADC, True. ADC samples on rising edge of ENCODE.  
Digital Output Ground.  
Digital Output Power Supply (2.7 V to 3.6 V).  
Out-of-Range Output.  
8
12, 21, 24, 31  
13, 22, 23, 32  
14  
OR  
15 to 20, 25 to 30  
D11 to D6, D5 to D0 Digital Output.  
41  
45  
46  
49  
50  
DNC  
Do Not Connect.  
VREFIN  
VREFOUT  
AIN  
Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground.  
Internal Reference Output (2.5 V Typical).  
Analog Input, True.  
AIN  
Analog Input, Complementary.  
Exposed Pad  
(TQFP_EP)  
Although not required in all applications, the exposed paddle on the underside of the TQFP_EP  
package should be soldered to the ground plane. Soldering the exposed paddle to the PCB  
increases the reliability of the solder joints, maximizing the thermal capability of the package.  
Rev. F | Page 7 of 16  
 
1...45678910...16

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