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AD8270ACPZ-WP

更新时间： 2024-02-22 21:00:07
品牌 Logo 应用领域
亚德诺 - ADI 放大器
页数 文件大小 规格书
20页 606K
描述
Precision Dual-Channel, Difference Amplifier

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AD8270ACPZ-WP 技术参数

Source Url Status Check Date：2013-05-01 14:56:25.164是否无铅： 含铅
是否Rohs认证： 符合生命周期：Active
零件包装代码：CSP包装说明：QCCN, LCC16,.16SQ,25
针数：16Reach Compliance Code：compliant
风险等级：1.72放大器类型：OPERATIONAL AMPLIFIER
JESD-30 代码：S-PQCC-N16JESD-609代码：e3
湿度敏感等级：3标称负供电电压 (Vsup)：-15 V
功能数量：2端子数量：16
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：QCCN
封装等效代码：LCC16,.16SQ,25封装形状：SQUARE
封装形式：CHIP CARRIER电源：+-15 V
认证状态：Not Qualified子类别：Operational Amplifier
最大压摆率：4 mA标称供电电压 (Vsup)：15 V
表面贴装：YES温度等级：INDUSTRIAL
端子面层：Matte Tin (Sn)端子形式：NO LEAD
端子节距：0.635 mm端子位置：QUAD
Base Number Matches：1

AD8270ACPZ-WP 数据手册

 浏览型号AD8270ACPZ-WP的Datasheet PDF文件第2页浏览型号AD8270ACPZ-WP的Datasheet PDF文件第3页浏览型号AD8270ACPZ-WP的Datasheet PDF文件第4页浏览型号AD8270ACPZ-WP的Datasheet PDF文件第6页浏览型号AD8270ACPZ-WP的Datasheet PDF文件第7页浏览型号AD8270ACPZ-WP的Datasheet PDF文件第8页 
AD8270  
ABSOLUTE MAXIMUM RATINGS  
Table 4.  
Parameter  
MAXIMUM POWER DISSIPATION  
Rating  
The maximum safe power dissipation for the AD8270 is limited  
by the associated rise in junction temperature (TJ) on the die. At  
approximately 130°C, which is the glass transition temperature,  
the plastic changes its properties. Even temporarily exceeding  
this temperature limit may change the stresses that the package  
exerts on the die, permanently shifting the parametric performance  
of the amplifiers. Exceeding a temperature of 130°C for an  
extended period of time can result in a loss of functionality.  
Supply Voltage  
Output Short-Circuit Current  
18 V  
See derating  
curve in Figure 2  
VS  
−65°C to +130°C  
−40°C to +85°C  
130°C  
1 kV  
1 kV  
Input Voltage Range  
Storage Temperature Range  
Specified Temperature Range  
Package Glass Transition Temperature (TG)  
ESD (Human Body Model)  
ESD (Charge Device Model)  
ESD (Machine Model)  
The AD8270 has built-in, short-circuit protection that limits the  
output current to approximately 100 mA (see Figure 19 for  
more information). While the short-circuit condition itself does  
not damage the part, the heat generated by the condition can  
cause the part to exceed its maximum junction temperature,  
with corresponding negative effects on reliability.  
0.1 kV  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
3.2  
T
MAXIMUM = 130°C  
J
2.8  
2.4  
2.0  
1.6  
PAD SOLDERED  
= 57°C/W  
θ
JA  
THERMAL RESISTANCE  
Table 5. Thermal Resistance  
Thermal Pad  
1.2  
0.8  
0.4  
0
θJA  
Unit  
PAD NOT SOLDERED  
= 96°C/W  
θ
JA  
16-Lead LFCSP with Thermal Pad  
Soldered to Board  
16-Lead LFCSP with Thermal Pad  
Not Soldered to Board  
57  
°C/W  
96  
°C/W  
–50  
–25  
0
25  
50  
75  
100  
125  
AMBIENT TEMPERATURE (°C)  
The θJA values in Table 5 assume a 4-layer JEDEC standard  
board with zero airflow. If the thermal pad is soldered to the  
board, it is also assumed it is connected to a plane. θJC at the  
exposed pad is 9.7°C/W.  
Figure 2. Maximum Power Dissipation vs. Ambient Temperature  
ESD CAUTION  
Rev. 0 | Page 5 of 20  
 
 
 
 
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