AD671
23
24
17
VLOGIC
VCC
VEE
20
22
AIN
BIT1
1
BIT12 12
±
U3
5V
+
15V
Capacitor Values
0.1 µF (Ceramic) and 10 µF (Tantalum).
(Surface Mount Chip Capacitors Recom-
mended to Reduce Lead Inductance).
ACOM
ENCODE 16
2
AD586
U4
+V
IN
18 DCOM
15
14
13
DAV
OTR
MSB
8
VOUT
NOISE
6
19 REF IN
Capacitor Locations Directly at Positive and Negative
Supply Pins to Respective Ground Plane.
REDUCTION
6.8µF
C15
1µF
C14
21 BPO/UPO
GND
4
AD671
Analog Ground
Digital Ground
Ground Plane or Wide Ground Return
Connected to the Analog Power Supply.
Figure 5. AD586 as Reference Input for AD671
Ground Plane or Wide Ground Return
Connected to the Digital Power Supply.
Proper grounding and decoupling should be a primary design
objective in any high speed, high resolution system. The AD671
separates analog and digital grounds to optimize the manage-
ment of analog and digital ground currents in a system. The
AD671 is designed to minimize the current flowing from
ACOM (Pin 22) by directing the majority of the current from
Analog and Digital
Ground
Connected Together Once at the AD671.
The AD671 is factory trimmed to minimize offset, gain and lin-
earity errors. In some applications the offset and gain errors of
the AD671 need to be externally adjusted to zero. This is ac-
complished by trimming the voltage at BPO/UPO (Pin 21) and
REFIN (Pin 19). In those applications the AD588, a high preci-
sion pin programmable voltage reference, is an ideal choice. The
AD588 includes a reference cell and three additional amplifiers
which can be configured to provide offset and gain trims for the
AD671. The circuit in Figure 7 is recommended for calibrating
offset and gain errors of the AD671 when configured in the 0 V
to +10 V input range.
V
CC (+5 V–Pin 23) to VEE (–5 V–Pin 24). Minimizing analog
ground currents hence reduces the potential for large ground
voltage drops. This can be especially true in systems that do not
utilize ground planes or wide ground runs. ACOM is also con-
figured to be code independent, therefore reducing input depen-
dent analog ground voltage drops and errors. The input current
supplied by the external reference (REFIN–Pin 19) and the ma-
jority of the full-scale input signal (AIN–Pin 20) are also di-
rected to VÉE. Also critical in any high speed digital design are
the use of proper digital grounding techniques to avoid potential
CMOS “ground bounce.” Figure 6 is provided to assist in the
proper layout, grounding and decoupling techniques.
+
–
+
5V
5V
5V
10µF
10µF
10µF
Table I is a list of grounding and decoupling guidelines that
should be reviewed before laying out a printed circuit board.
0.1µF
0.1µF
23
0.1µF
24
VEE
17
VLOGIC
VCC
+
0 TO 10V
+
–
+
5V
5V
5V
20
22
AIN
12
BIT1
+
15V
R1
100
1
BIT12
10µF
10µF
10µF
39k
ACOM
ENCODE 16
150pF
18 DCOM
15
14
13
DAV
OTR
MSB
0.1µF
23
0.1µF
24
VEE
0.1µF
1µF
6
4
3
7
50
1
19 REF IN
17
VLOGIC
10µF
0.1µF
0.1µF
14
VCC
21 BPO/UPO
1µF
10k
+
AD671
AD588
15
20
150
15
AIN
12
BIT1
10µF
+
2
–
15
16
1
±
BIT12
V
5V
IN
5
9
10
8
12 11 13
–
22
ACOM
16
15
14
13
ENCODE
R2
5k
AGP*
100k
50
18 DCOM
19
DAV
OTR
MSB
DGP*
REF IN
+
5V REF
Figure 7. Unipolar (0 V to +10 V) Calibration
The AD671 is intended to have a nominal 1/2 LSB offset so
that the exact analog input for a given code will be in the middle
of that code (halfway between the transitions to the codes above
it and below it). Thus, the first transition ( from 0000 0000 0000
to 0000 0000 0001) will occur for an input level of +1/2 LSB
(1.22 mV for 10 V range). If the offset trim resistor R2 is used,
21
BPO/UPO
AD671
*GROUND PLANE RECOMMENDED
Figure 6. AD671 Grounding and Decoupling
REV. B
–9–