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AD6624AS/PCB PDF预览

AD6624AS/PCB

更新时间: 2024-02-01 14:59:08
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
40页 611K
描述
Four-Channel, 100 MSPS Digital Receive Signal Processor (RSP)

AD6624AS/PCB 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:FQFP,针数:128
Reach Compliance Code:unknownECCN代码:5A991.B.1
HTS代码:8542.31.00.01风险等级:5.82
JESD-30 代码:R-PQFP-G128长度:20 mm
功能数量:1端子数量:128
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:FQFP
封装形状:RECTANGULAR封装形式:FLATPACK, FINE PITCH
认证状态:Not Qualified座面最大高度:3.4 mm
标称供电电压:2.5 V表面贴装:YES
技术:CMOS电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
宽度:14 mmBase Number Matches:1

AD6624AS/PCB 数据手册

 浏览型号AD6624AS/PCB的Datasheet PDF文件第6页浏览型号AD6624AS/PCB的Datasheet PDF文件第7页浏览型号AD6624AS/PCB的Datasheet PDF文件第8页浏览型号AD6624AS/PCB的Datasheet PDF文件第10页浏览型号AD6624AS/PCB的Datasheet PDF文件第11页浏览型号AD6624AS/PCB的Datasheet PDF文件第12页 
AD6624A  
ABSOLUTE MAXIMUM RATINGS  
*
EXPLANATION OF TEST LEVELS  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 V  
Input Voltage . . . . . . . . . . . . –0.3 V to +5.3 V (5 V Tolerant)  
Output Voltage Swing . . . . . . . . . . –0.3 V to VDDIO + 0.3 V  
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF  
Junction Temperature Under Bias . . . . . . . . . . . . . . . . 125°C  
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C  
Lead Temperature (5 sec) . . . . . . . . . . . . . . . . . . . . . . . 280°C  
*Stresses greater than those listed above may cause permanent damage to the  
device. These are stress ratings only; functional operation of the device at these or  
any other conditions greater than those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
I. 100% Production Tested.  
II. 100% Production Tested at 25°C, and Sample Tested at  
Specified Temperatures.  
III. Sample Tested Only.  
IV. Parameter Guaranteed by Design and Analysis.  
V. Parameter is Typical Value Only.  
VI. 100% Production Tested at 25°C, and Sample Tested at  
Temperature Extremes.  
Thermal Characteristics  
196-Lead Ball Grid Array:  
θ
θ
JA = 26.3°C/W, No Airflow  
JA = 22°C/W, 200 LFPM Airflow  
Thermal measurements made in the horizontal position on  
a 4-layer board.  
ORDERING GUIDE  
Package  
Option  
Model  
Temperature Range  
Package Description  
AD6624AABC  
AD6624AS/PCB  
–40°C to +85°C (Ambient)  
196-Lead BGA (Ball Grid Array)  
Evaluation Board with AD6624A and Software  
BC-196  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD6624A features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
REV. 0  
–9–  

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