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AD5751ACPZ-REEL7 PDF预览

AD5751ACPZ-REEL7

更新时间: 2024-01-02 04:40:08
品牌 Logo 应用领域
亚德诺 - ADI 驱动接口集成电路
页数 文件大小 规格书
32页 609K
描述
Industrial I/V Output Driver, Single-Supply, 55 V Maximum Supply, Programmable Ranges

AD5751ACPZ-REEL7 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC32,.2SQ,20针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.64
内置保护:OVER CURRENT接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:S-XQCC-N32JESD-609代码:e3
长度:5 mm湿度敏感等级:1
功能数量:1端子数量:32
最高工作温度:105 °C最低工作温度:-40 °C
输出电流流向:SINK标称输出峰值电流:0.015 A
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC32,.2SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):225
电源:3/5,12/55 V认证状态:Not Qualified
座面最大高度:1 mm子类别:Peripheral Drivers
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:5 mmBase Number Matches:1

AD5751ACPZ-REEL7 数据手册

 浏览型号AD5751ACPZ-REEL7的Datasheet PDF文件第6页浏览型号AD5751ACPZ-REEL7的Datasheet PDF文件第7页浏览型号AD5751ACPZ-REEL7的Datasheet PDF文件第8页浏览型号AD5751ACPZ-REEL7的Datasheet PDF文件第10页浏览型号AD5751ACPZ-REEL7的Datasheet PDF文件第11页浏览型号AD5751ACPZ-REEL7的Datasheet PDF文件第12页 
Data Sheet  
AD5751  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted. Transient currents of up to  
100 mA do not cause SCR latch-up.  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Table 4.  
Parameter  
Rating  
AVDD to GND  
DVCC to GND  
−0.3 V to +58 V  
−0.3 V to +7 V  
Digital Inputs to GND  
−0.3 V to DVCC + 0.3 V, or 7 V  
(whichever is less)  
ESD CAUTION  
Digital Outputs to GND  
−0.3 V to DVCC + 0.3 V, or 7 V  
(whichever is less)  
VREF to GND  
VSENSE+ to GND  
VIN to GND  
−0.3 V to +7 V  
−0.3 V to AVDD  
−0.3 V to +7 V  
−0.3 V to AVDD  
VOUT, IOUT to GND  
Operating Temperature Range  
Industrial  
Storage Temperature Range  
Junction Temperature (TJ max)  
32-Lead LFCSP Package  
θJA Thermal Impedance1  
Lead Temperature  
Soldering  
−40°C to +105°C  
−65°C to +150°C  
125°C  
42°C/W  
JEDEC industry standard  
J-STD-020  
1 Simulated data based on a JEDEC 2s2p test board with thermal vias.  
Rev. D | Page 9 of 32  
 
 

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