Datasheet > ACPM-7812-TR1

ACPM-7812-TR1

更新时间： 2024-02-22 13:54:14

品牌	Logo	应用领域
其他 - ETC		射频微波
页数	文件大小	规格书
24页	192K
描述
Amplifier. Other

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技术参数
数据手册

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ACPM-7812-TR1 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.29.00.75	风险等级：	5.92
Is Samacsys：	N	特性阻抗：	50 Ω
构造：	COMPONENT	增益：	24 dB
最大输入功率 (CW)：	10 dBm	JESD-609代码：	e0
最大工作频率：	849 MHz	最小工作频率：	824 MHz
最高工作温度：	85 °C	最低工作温度：	-30 °C
射频/微波设备类型：	NARROW BAND MEDIUM POWER	端子面层：	Tin/Lead (Sn/Pb)
最大电压驻波比：	2.5	Base Number Matches：	1

ACPM-7812-TR1 数据手册

form its phase from solid to

liquids. The dwell time at melting The recommended solder paste is

point 183°C shall maintain at type Sn6337A or Sn60Pb40A of

between 60 to 150 seconds. Upon J-STD-006.

Solder Paste

Zone 1 – Preheat Zone

The average heat up rate for

surface-mount component on

PCB shall be less than 3°C/

second to allow even heating for

both the component and PCB.

This ramp is maintained until it

reaches 100°C where flux

activation starts.

Note: Solder paste storage and shelf

the duration of 10-20 seconds at

peak temperature, it is then

cooled down rapidly to allow the

solder to freeze and form solid.

life shall be in accordance with

manufacturer’s specifications.

Stencil or Screen

The solder paste may be depos-

ited onto PCB by either screen

printing, using a stencil or

syringe dispensing. The recom-

mended stencil thickness is in

accordance to JESD22-B102-C.

Extended duration above the

solder melting point can poten-

tially damage temperature

sensitive components and result

in excessive inter-metallic growth

that causes brittle solder joint,

weak and unreliable connections.

It can lead to unnecessary dam-

age to the PC Board and discol-

oration to component’s leads.

Zone 2 – Soak Zone

The flux is being activated here

to prepare for even and smooth

solder joint in subsequent zone.

The temperature ramp is kept

gradual to minimize thermal

mismatch between solder, PC

Board and components. Over-

ramp rate here can cause solder

splatter due to excessive oxida-

tion of paste.

Zone 4 – Cooling Zone

The temperature ramp down rate

is 6°C/second maximum. It is

important to control the cooling

rate as fast as possible in order

to achieve the smaller grain size

for solder and increase fatigue

resistance of solder joint.

Zone 3 – Reflow Zone

The third process zone is the

solder reflow zone. The tempera-

ture in this zone rises rapidly

from 183°C to peak temperature

of 235°C for the solder to trans-

Nominal stencil thickness

Component lead pitch

0.102 mm (0.004 in)

0.152 mm (0.006 in)

0.203 mm (0.008 in)

Lead pitch less than 0.508 mm (0.020 in)

0.508 mm to 0.635 mm (0.02 in to 0.025 in)

Lead pitch greater than 0.635 mm (0.025 in)

1...20 21 222324

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