ABS202 THRU ABS210
SINGLE PHASE2.0AMPS. GLASS PASSIVATED BRIDGE RECTIFIERS
FEATURE
ABS
.165(4.2)
.Glass passivated junction.
.010(.25)
.006(.15)
.150(3.8)
.Ideal for printed circuit board.
.Reliable low cost construction utilizing
molded plastic technique.
.006(.15)
.002(.05)
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+
.260(6.60)
.248(6.30)
.181(4.6)
.173(4.4)
.High surge current capability.
.High temperature soldering guaranteed:
260℃/10 seconds at terminals.
.UL Recognized File # E338195.
5°
5°
R.004(R.1)
.030(.75)
MECHANICAL DATA
.033(.75)
.022(.55)
.018(.45)
.Case Material: “Green” Molding compound,
UL flammability classification rating 94V-0,
“Free halogen”
.201(5.1)
.193(4.9)
.028(.70)
.020(.50)
.059(1.5)
.051(1.3)
.Moisture sensitivity level:level 2a,per J-STD-020
.Polarity:Polarity as marked on the body
.Weight: 0.10g (approximately)
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~~
+
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz,resistive or inductive load.
For capacitive load, derate current by 20%
SYM
Type Number
BOL
ABS202
ABS204
ABS206
ABS208
ABS210
units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
V
V
V
VRRM
VRMS
VDC
Maximum DC blocking Voltage
Maximum Average Forward rectified Current
@ TA=40℃
1000
2.0
IF(AV)
A
A
Peak Forward Surge Current 8.3ms single half
sine-wave superimposed on rate load (JEDEC
method)
55
IFSM
Maximum Instantaneous
Forward Voltage
@ IF =2.0A DC
@ IF = 1.0A DC
1.1
0.95
V
VF
IR
Maximum DC Reverse Current @TJ =25°C
5.0
μA
at rated DC blocking voltage
I2t Rating for Fusing (t﹤8.3ms)
@TJ =125°C
100.0
12.5
A2Sec
pF
2
I t
Typical Junction Capacitance Per Leg (Note1)
25
CJ
RJC
RJA
TSTG
TJ
18
Typical Thermal Resistance (Note2)
°C /W
50
Storage Temperature
Operating Junction Temperature
Note:
-55 to +150
-55 to +150
°C
°C
1. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
2. Thermal resistance junction to case, lead and ambient in accordance with JESD-51.
Unit mounted on glass-epoxy substrate with 1oz/ft2_20x20 mm copper pad per pin with heatsink
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