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AAT3688IWP-4.2-T1 PDF预览

AAT3688IWP-4.2-T1

更新时间: 2024-01-17 16:53:08
品牌 Logo 应用领域
ANALOGICTECH 电池
页数 文件大小 规格书
23页 527K
描述
USB Port Lithium-Ion/Polymer Battery Charger

AAT3688IWP-4.2-T1 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknown风险等级:5.79

AAT3688IWP-4.2-T1 数据手册

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AAT3688  
USB Port Lithium-Ion/Polymer Battery Charger  
the AAT3688 status data control will reply the data  
word back to the system microcontroller after a  
Data Timing  
The system microcontroller should assert an active  
low data request pulse for minimum duration of  
200ns; this is specified by TLO(DATA). Upon sensing  
the rising edge of the end of the data request pulse,  
delay specified by the data report time specification  
DATA(RPT). The period of the following group of data  
T
pulses will be specified by the TDATA specification.  
Timing Diagram  
SQPULSE  
PDATA  
SQ  
System Reset  
System Start  
CK  
TSYNC  
TLAT  
TOFF  
Data  
TDATA(RPT) = TSYNC + TLAT < 2.5 PDATA  
TOFF > 2 PDATA  
N=3  
N=1  
N=2  
Where:  
Thermal Considerations  
The AAT3688 is packaged in a Pb-free, 3x3mm  
TDFN package which can provide up to 2.0W of  
power dissipation when it is properly bonded to a  
printed circuit board and has a maximum thermal  
resistance of 50°C/W. Many considerations should  
be taken into account when designing the printed  
circuit board layout, as well as the placement of the  
charger IC package in proximity to other heat gen-  
erating devices in a given application design. The  
ambient temperature around the charger IC will  
also have an affect on the thermal limits of a bat-  
tery charging application. The maximum limits that  
can be expected for a given ambient condition can  
be estimated by the following discussion.  
PD = Total Power Dissipation by the Device  
VIN = Input Voltage Level, VUSB  
VBAT = Battery Voltage as Seen at the BAT Pin  
ICC = Maximum Constant Fast Charge Current  
Programmed for the Application  
IOP = Quiescent Current Consumed by the  
Charger IC for Normal Operation  
Next, the maximum operating ambient temperature  
for a given application can be estimated based on  
the thermal resistance of the 3x3mm TDFN pack-  
age when sufficiently mounted to a PCB layout and  
the internal thermal loop temperature threshold.  
First, the maximum power dissipation for a given  
situation should be calculated:  
TA = TJ - (θJA  
· PD)  
Eq. 5:  
PD = [(VIN - VBAT) · ICC + (VIN · IOP)]  
Eq. 4:  
18  
3688.2006.04.1.3  

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