A89503
80 V Automotive Half-Bridge MOSFET Driver
PACKAGE OUTLINE DRAWING
For Reference Only – Not for Tooling Use
(Reference MO-153 ADT)
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
7.80 0.10
4.32 NOM
8º
0º
24
0.20
0.09
B
3 NOM 4.40 0.10 6.40 0.20
A
1.00 REF
0.60 0.15
1
2
0.25 BSC
SEATING PLANE
GAUGE PLANE
C
24X
1.20 MAX
SEATING
0.10
C
PLANE
0.30
0.19
0.65 BSC
0.15
0.00
0.45
0.65
1.65
A
B
C
Terminal #1 mark area
Exposed thermal pad (bottom surface); dimensions may vary with device
Reference land pattern layout (reference IPC7351 TSOP65P640X120-25M);
all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
3.00
6.10
4.32
C
PCB Layout Reference View
Figure 11: Package LP, 24-Lead TSSOP with Exposed Pad
44
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com