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A82DL1624UG-70I

更新时间： 2024-02-16 04:22:38
品牌 Logo 应用领域
联笙电子 - AMICC 闪存静态存储器
页数 文件大小 规格书
57页 896K
描述
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S

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A82DL1624UG-70I 技术参数

生命周期：Contact Manufacturer包装说明：,
Reach Compliance Code：unknown风险等级：5.69
Base Number Matches：1

A82DL1624UG-70I 数据手册

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A82DL16x4T(U) Series  
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM,  
A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only,  
Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) Static RAM  
Preliminary  
DISTINCTIVE CHARACTERISTICS  
MCP Features  
- Suspends erase operations to allow programming in  
same bank  
ꢀSingle power supply operation 2.7 to 3.6 volt  
ꢀHigh Performance  
- Access time as fast as 70ns  
ꢀPackage 69-Ball TFBGA (8x11x1.4 mm)  
ꢀ Industrial operating temperature range: -40°C to 85°C  
for –U; -25°C to 85°C for –I  
ꢀ
Polling and Toggle Bit  
Data  
- Provides a software method of detecting the status of  
program or erase cycles  
ꢀUnlock Bypass Program command  
- Reduces overall programming time when issuing  
multiple program command sequences  
Flash Features  
HARDWARE FEATURES  
ꢀAny combination of sectors can be erased  
ARCHITECTURAL ADVANTAGES  
ꢀSimultaneous Read/Write operations  
- Data can be continuously read from one bank while  
executing erase/program functions in other bank  
- Zero latency between read and write operations  
ꢀMultiple bank architectures  
- Three devices available with different bank sizes (refer to  
Table 2)  
ꢀPackage  
ꢀReady/  
output (RY/  
)
BY  
Busy  
- Hardware method for detecting program or erase cycle  
completion  
ꢀHardware reset pin (  
)
RESET  
- Hardware method of resetting the internal state machine  
to reading array data  
ꢀ
/ACC input pin  
WP  
- 69-Ball TFBGA (8x11x1.4 mm)  
ꢀTop or bottom boot block  
- Write protect (  
outermost boot sectors, regardless of sector protect  
status  
) function allows protection of two  
WP  
ꢀManufactured on 0.18 µm process technology  
- Compatible with AM42DL16x4D devices  
ꢀCompatible with JEDEC standards  
- Pinout and software compatible with single-power-supply  
flash standard  
- Acceleration (ACC) function accelerates program timing  
ꢀSector protection  
- Hardware method of locking a sector, either in-system or  
using programming equipment, to prevent any program  
or erase operation within that sector  
PERFORMANCE CHARACTERISTICS  
ꢀHigh performance  
- Temporary Sector Unprotect allows changing data in  
protected sectors in-system  
- Access time as fast as 70ns  
- Program time: 7µs/word typical utilizing Accelerate  
function  
LP SRAM Features  
ꢀUltra low power consumption (typical values)  
- 2mA active read current at 1MHz  
- 10mA active read current at 5MHz  
- 200nA in standby or automatic sleep mode  
ꢀMinimum 1 million write cycles guaranteed per sector  
ꢀ20 Year data retention at 125°C  
- Reliable operation for the life of the system  
ꢀPower supply range: 2.7V to 3.6V  
ꢀAccess times: 70 ns (max.)  
ꢀCurrent:  
Very low power version: Operating: 35mA(max.)  
Standby: 10uA (max.)  
ꢀFull static operation, no clock or refreshing required  
ꢀAll inputs and outputs are directly TTL-compatible  
ꢀCommon I/O using three-state output  
ꢀOutput enable and two chips enable inputs for easy  
application  
SOFTWARE FEATURES  
ꢀSupports Common Flash Memory Interface (CFI)  
ꢀErase Suspend/Erase Resume  
ꢀData retention voltage: 2.0V (min.)  
PRELIMINARY (July, 2005, Version 0.0)  
1
AMIC Technology, Corp.  
1234567...57

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与A82DL1624UG-70I相关器件

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A82DL1624UG-70IF AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit
A82DL1624UG-70U AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit
A82DL1624UG-70UF AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit
A82DL1632 AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70 AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70F AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70I AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70IF AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70U AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70UF AMICC

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 		Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit

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