生命周期: | Active | 包装说明: | TFBGA, |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.75 | JESD-30 代码: | S-PBGA-B288 |
长度: | 11 mm | 可配置逻辑块数量: | 1536 |
等效关口数量: | 60000 | 端子数量: | 288 |
组织: | 1536 CLBS, 60000 GATES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
座面最大高度: | 1.05 mm | 最大供电电压: | 1.575 V |
最小供电电压: | 1.425 V | 标称供电电压: | 1.5 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 11 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F060M3G-1CS288ES | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS288I | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS288Y | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS288YC | MICROSEMI |
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FPGA |
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A2F060M3G-1CS288YES | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS288YI | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS484 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS484ES | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS484I | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3G-1CS484Y | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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