是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | TFBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.76 |
JESD-30 代码: | S-PBGA-B288 | 长度: | 11 mm |
湿度敏感等级: | 3 | 可配置逻辑块数量: | 1536 |
等效关口数量: | 60000 | 端子数量: | 288 |
组织: | 1536 CLBS, 60000 GATES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
座面最大高度: | 1.05 mm | 最大供电电压: | 1.575 V |
最小供电电压: | 1.425 V | 标称供电电压: | 1.5 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 11 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F060M3F-1CSG288YC | MICROSEMI |
获取价格 |
FPGA |
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A2F060M3F-1CSG288YES | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG288YI | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG484 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG484ES | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG484I | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG484Y | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG484YES | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSG484YI | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
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A2F060M3F-1CSH288Y | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PBGA288, 0.50 MM PITCH, HALOG |
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