是否Rohs认证: | 不符合 | 生命周期: | Active |
包装说明: | LBGA, BGA256,16X16,40 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.9 |
最大时钟频率: | 100 MHz | JESD-30 代码: | S-PBGA-B256 |
JESD-609代码: | e0 | 长度: | 17 mm |
湿度敏感等级: | 3 | 可配置逻辑块数量: | 1536 |
等效关口数量: | 60000 | 输入次数: | 66 |
逻辑单元数量: | 1536 | 输出次数: | 66 |
端子数量: | 256 | 组织: | 1536 CLBS, 60000 GATES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装等效代码: | BGA256,16X16,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 峰值回流温度(摄氏度): | 225 |
电源: | 1.5,1.8,2.5,3.3 V | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 1.7 mm |
子类别: | Field Programmable Gate Arrays | 最大供电电压: | 1.575 V |
最小供电电压: | 1.425 V | 标称供电电压: | 1.5 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 17 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F060M3F-1FG256I | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F060M3F-1FG256Y | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F060M3F-1FG256Y | ACTEL |
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Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256 | |
A2F060M3F-1FG256YC | MICROSEMI |
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FPGA | |
A2F060M3F-1FG256YES | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F060M3F-1FG256YI | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F060M3F-1FG256YI | ACTEL |
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Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256 | |
A2F060M3F-1FG256YM | MICROSEMI |
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暂无描述 | |
A2F060M3F-1FG288 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F060M3F-1FG288ES | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) |