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97SD3240RPMK PDF预览

97SD3240RPMK

更新时间: 2024-02-28 04:46:43
品牌 Logo 应用领域
麦斯威 - MAXWELL 动态存储器
页数 文件大小 规格书
39页 741K
描述
Synchronous DRAM, 32MX40, 6ns, CMOS, STACK, QFP-132

97SD3240RPMK 技术参数

生命周期:Obsolete包装说明:GQFF, QFL132,1.35SQ,25
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.36风险等级:5.7
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:6 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):133.33 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:S-XQFP-F132
长度:34.29 mm内存密度:1342177280 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:40
功能数量:1端口数量:1
端子数量:132字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:32MX40封装主体材料:UNSPECIFIED
封装代码:GQFF封装等效代码:QFL132,1.35SQ,25
封装形状:SQUARE封装形式:FLATPACK, GUARD RING
认证状态:Not Qualified刷新周期:8192
反向引出线:NO自我刷新:YES
连续突发长度:1,2,4,8最大待机电流:0.15 A
最小待机电流:3 V最大压摆率:0.575 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:0.635 mm
端子位置:QUAD总剂量:100k Rad(Si) V
宽度:34.29 mmBase Number Matches:1

97SD3240RPMK 数据手册

 浏览型号97SD3240RPMK的Datasheet PDF文件第2页浏览型号97SD3240RPMK的Datasheet PDF文件第3页浏览型号97SD3240RPMK的Datasheet PDF文件第4页浏览型号97SD3240RPMK的Datasheet PDF文件第6页浏览型号97SD3240RPMK的Datasheet PDF文件第7页浏览型号97SD3240RPMK的Datasheet PDF文件第8页 
97SD3240  
1.25Gb (8-Meg X 40-Bit X 4-Banks) SDRAM  
TABLE 5. AC Electrical Characteristics  
(V =3.3V + 0.3V, V Q = 3.3V + 0.3V, T = -55 TO 125°C, UNLESS OTHERWISE SPECIFIED)  
CC  
CC  
A
PARAMETER  
SYMBOL  
SUBGROUPS  
MIN  
TYPICAL  
MAX  
UNIT  
System clock cycle time1  
tCK  
9, 10, 11  
ns  
(CAS latency = 2)  
(CAS latency = 3)  
10  
7.5  
CLK high pulse width1,7  
CLK low pulse width1,7,  
tCKH  
tCKL  
tAC  
9, 10, 11  
9, 10, 11  
9, 10, 11  
2.5  
2.5  
ns  
ns  
ns  
1,2  
Access time from CLK  
(CAS latency = 2)  
(CAS latency = 3)  
6
6
Data-out hold time1,2,3  
CLK to Data-out low impedance1,2,3,7  
CLK to Data-out high impedance1,47,  
(CAS latency = 2, 3)  
tOH  
tLZ  
9, 10, 11  
9, 10, 11  
9, 10, 11  
2.7  
2
ns  
ns  
ns  
tHZ  
5.4  
Input setup time1,5,6  
tAS, tCS,  
tDS, tCES  
9, 10, 11  
1.5  
ns  
CKE setup time for power down exit1  
Input hold time1,6  
tCESP  
9, 10, 11  
9, 10, 11  
1.5  
1.5  
ns  
ns  
tAH, tCH, tDH  
tCEH  
Ref/Active to Ref/Active command period1  
Active to Precharge command period1  
Active command to column command 1  
(same bank)  
tRC  
tRAS  
tRCD  
9, 10, 11  
9, 10, 11  
9, 10, 11  
70  
50  
20  
ns  
ns  
ns  
120000  
Precharge to Active command period1  
tRP  
tDPL  
tRRD  
tT  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
9, 10, 11  
@ 105 °C  
@ 85 °C  
@ 70 °C  
20  
20  
20  
1
ns  
ns  
ns  
ns  
ms  
Write recovery or data-in to precharge lead time1  
Active( a) to Active (b) command period1  
Transition time(rise and fall)7  
5
Refresh Period  
tREF  
16  
32  
6.4  
168  
64  
128  
1. AC measurement assumes tT=1ns. Reference level for timing of input signals is 1.5V.  
2. Access time is measured at 1.5V.  
3. tLZ(min) definesthe time at which the outputs achieve the low impedance state.  
4. tHZ(min) defines the time at which the outputs achieve the high impedance state.  
5. tCES defines CKE setup time to CLK rising edge except for the power down exit command.  
6. tAS/tAH: Address, tCS/tCH: /RAS, /CAS, /WE, DQM  
7. Guarenteed by design (Not tested).  
8. Guarenteed by Device Charactreization Testing. (Not 100% Tested)  
02.04.05 Rev 3  
All data sheets are subject to change without notice  
5
©2005 Maxwell Technologies  
All rights reserved.  

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