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93LC46B-TI/STX PDF预览

93LC46B-TI/STX

更新时间： 2024-11-27 15:45:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟光电二极管内存集成电路
页数 文件大小 规格书
38页 703K
描述
64 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8

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93LC46B-TI/STX 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：TSSOP,针数：8
Reach Compliance Code：compliant风险等级：5.13
最大时钟频率 (fCLK)：3 MHzJESD-30 代码：R-PDSO-G8
JESD-609代码：e3长度：4.4 mm
内存密度：1024 bit内存集成电路类型：EEPROM
内存宽度：16湿度敏感等级：1
功能数量：1端子数量：8
字数：64 words字数代码：64
工作模式：SYNCHRONOUS最高工作温度：85 °C
最低工作温度：-40 °C组织：64X16
封装主体材料：PLASTIC/EPOXY封装代码：TSSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行：SERIAL峰值回流温度（摄氏度）：260
认证状态：Not Qualified座面最大高度：1.1 mm
串行总线类型：MICROWIRE最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：2.5 V标称供电电压 (Vsup)：3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：MATTE TIN
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：40
宽度：3 mm最长写入周期时间 (tWC)：6 ms
Base Number Matches：1

93LC46B-TI/STX 数据手册

 浏览型号93LC46B-TI/STX的Datasheet PDF文件第2页浏览型号93LC46B-TI/STX的Datasheet PDF文件第3页浏览型号93LC46B-TI/STX的Datasheet PDF文件第4页浏览型号93LC46B-TI/STX的Datasheet PDF文件第5页浏览型号93LC46B-TI/STX的Datasheet PDF文件第6页浏览型号93LC46B-TI/STX的Datasheet PDF文件第7页 
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C  
93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C  
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C  
93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C  
1K-16K Microwire Compatible Serial EEPROMs  
Features:  
Description:  
• Densities from 1 Kbits through 16 Kbits  
• Low-power CMOS technology  
Microchip Technology Inc. supports the 3-wire  
Microwire bus with low-voltage serial Electrically  
Erasable PROMs (EEPROM) that range in density  
from 1 Kbits up to 16 Kbits. Each density is available  
with and without the ORG functionality, and selected by  
the part number ordered. Advanced CMOS technology  
makes these devices ideal for low power, nonvolatile  
memory applications. The entire series of Microwire  
devices are available in the standard 8-lead PDIP and  
SOIC packages as well as the more advanced packag-  
ing such as the 8-lead MSOP, 8-lead TSSOP, 6-lead  
SOT-23, and 8-lead DFN (2x3). These packages are all  
available in a Pb-free (Matte Tin) finish. Packaging with  
the Sn/Pb finish is also available as a custom device.  
• Available with or without ORG function:  
With ORG function:  
- ORG pin at Logic LO: 8-bit word  
- ORG pin at Logic HI: 16-bit word  
Without ORG function:  
- ‘A’ version: 8-bit word  
- ‘B’ version: 16-bit word  
• Program Enable pin:  
- Write-protect for entire array  
(93XX76C and 93XX86C only)  
• Self-timed Erase/Write cycles  
(including auto-erase)  
Pin Diagrams (not to scale)  
PDIP/SOIC  
(P, SN)  
ROTATED SOIC  
(ex: 93LC46BX)  
• Automatic ERAL before WRAL  
• Power-on/off data protection circuitry  
• Industry standard 3-wire serial I/O  
• Device Status signal (Ready/Busy)  
• Sequential Read function  
(1,3)  
V
CC  
ORG  
1
2
3
4
CS  
CLK  
DI  
8
7
6
5
NC  
1
2
3
4
8
7
6
5
(2,3)  
VCC  
PE  
VSS  
(1,3)  
ORG  
CS  
DO  
DI  
• 1,000,000 E/W cycles  
DO  
CLK  
V
SS  
• Data retention > 200 years  
• Temperature ranges supported:  
DFN (MC)  
- Industrial (I)  
-40°C to +85°C  
-40°C to +125°C  
CS  
V
CC  
(2,3)  
1
8
- Automotive (E)  
PE  
7
6
5
CLK  
DI  
2
3
4
(1,3)  
ORG  
VSS  
DO  
Pin Function Table  
TSSOP/MSOP  
(ST, MS)  
Name  
Function  
SOT-23  
(OT)  
CS  
CLK  
DI  
Chip Select  
8
7
6
5
1
2
3
4
CS  
V
CC  
1
2
3
6
5
4
V
CC  
DO  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
(2,3)  
CLK  
PE  
ORG  
VSS  
CS  
CLK  
(1,3)  
DI  
DI  
V
SS  
DO  
DO  
VSS  
PE  
Note 1: ORG pin: Only on 93XX46C/56C/66C/76C/86C.  
2: PE pin: Only on 93XX76C/86C.  
Program Enable  
Memory Configuration  
Power Supply  
ORG  
VCC  
3: ORG/PE: No internal connections on 93XXA/B.  
Note:  
ORG and PE functionality not available in  
all products. See Table 1-1, Device  
Selection Table.  
Note:  
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.  
© 2005 Microchip Technology Inc.  
DS21929A-page 1  
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