是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | DIP | 包装说明: | DIP, DIP24,.6 |
针数: | 24 | Reach Compliance Code: | unknown |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.92 |
Is Samacsys: | N | JESD-30 代码: | R-CDIP-T24 |
JESD-609代码: | e0 | 内存密度: | 4096 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 24 |
字数: | 512 words | 字数代码: | 512 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 512X8 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | DIP |
封装等效代码: | DIP24,.6 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 筛选级别: | 38535Q/M;38534H;883B |
子类别: | OTP ROMs | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
9344-23-02-01 | ECS |
获取价格 |
Board Connector | |
9344-23-02-01-1PP | ECS |
获取价格 |
Board Connector | |
9344-23-02-03-PP | ECS |
获取价格 |
Board Connector | |
9344-23-03-01 | ECS |
获取价格 |
Board Connector | |
9344-23-03-01-1TR | ECS |
获取价格 |
Board Connector | |
9344-23-03-10-PP | ECS |
获取价格 |
Board Connector | |
9344-23-03-30-1 | ECS |
获取价格 |
Board Connector | |
9344-24-01-00-0600 | ECS |
获取价格 |
Board Stacking Connector | |
9344-24-01-00-1200 | ECS |
获取价格 |
Board Stacking Connector | |
9344-24-01-01-1200 | ECS |
获取价格 |
Board Stacking Connector |