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8537AY-01LFT PDF预览

8537AY-01LFT

更新时间: 2024-02-26 09:38:36
品牌 Logo 应用领域
艾迪悌 - IDT 驱动逻辑集成电路
页数 文件大小 规格书
14页 121K
描述
Low Skew Clock Driver, 5V Series, 2 True Output(s), 2 Inverted Output(s), PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBC, LQFP-48

8537AY-01LFT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBC, LQFP-48针数:48
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.12
系列:5V输入调节:STANDARD
JESD-30 代码:S-PQFP-G48JESD-609代码:e3
长度:7 mm逻辑集成电路类型:LOW SKEW CLOCK DRIVER
湿度敏感等级:3功能数量:6
反相输出次数:2端子数量:48
实输出次数:2最高工作温度:85 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP48,.35SQ,20
封装形状:SQUARE封装形式:FLATPACK
峰值回流温度(摄氏度):260电源:2.5/3.3 V
Prop。Delay @ Nom-Sup:1.5 ns传播延迟(tpd):1.5 ns
认证状态:Not QualifiedSame Edge Skew-Max(tskwd):0.13 ns
座面最大高度:1.6 mm子类别:Clock Drivers
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
温度等级:OTHER端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:7 mm最小 fmax:700 MHz
Base Number Matches:1

8537AY-01LFT 数据手册

 浏览型号8537AY-01LFT的Datasheet PDF文件第5页浏览型号8537AY-01LFT的Datasheet PDF文件第6页浏览型号8537AY-01LFT的Datasheet PDF文件第7页浏览型号8537AY-01LFT的Datasheet PDF文件第9页浏览型号8537AY-01LFT的Datasheet PDF文件第10页浏览型号8537AY-01LFT的Datasheet PDF文件第11页 
ICS8537-01  
HEX, LOW SKEW, 1-TO-2  
DIFFERENTIAL-TO-3.3V/2.5V LVPECL CLOCK BUFFER  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS8537-01.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS8537-01 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 130mA = 450.5mW  
Power (outputs)MAX = 30mW/Loaded Output pair  
If all outputs are loaded, the total power is 12 * 30mW = 360mW  
Total Power_MAX (3.465V, with all outputs switching) = 450.5mW + 360mW = 810.5mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device. The maximum recommended junction temperature for the devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = JunctionTemperature  
θJA = junction-to-ambient thermal resistance  
Pd_total =Total device power dissipation (example calculation is in section 1 above)  
TA = AmbientTemperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a  
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.811W * 42.1°C/W = 119.1°C. This is well below the limit of 125°C  
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
TABLE 6. THERMAL RESISTANCE θJA FOR 48-PIN LQFP, FORCED CONVECTION  
θJA byVelocity (Linear Feet per Minute)  
0
200  
55.9°C/W  
42.1°C/W  
500  
50.1°C/W  
39.4°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
8537AY-01  
www.idt.com  
REV.B NOVEMBER 22, 2010  
8

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