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84329BV-01LFT PDF预览

84329BV-01LFT

更新时间: 2024-01-14 14:23:29
品牌 Logo 应用领域
艾迪悌 - IDT 时钟外围集成电路晶体
页数 文件大小 规格书
19页 268K
描述
Clock Generator, 700MHz, PQCC28, 11.60 X 11.40 MM, 4.10 MM HEIGHT, PLASTIC, MS-018, LCC-28

84329BV-01LFT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:LCC
包装说明:11.60 X 11.40 MM, 4.10 MM HEIGHT, PLASTIC, MS-018, LCC-28针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.83
JESD-30 代码:S-PQCC-J28JESD-609代码:e3
长度:11.505 mm端子数量:28
最高工作温度:70 °C最低工作温度:
最大输出时钟频率:700 MHz封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):260
主时钟/晶体标称频率:25 MHz认证状态:Not Qualified
座面最大高度:4.57 mm最大供电电压:3.465 V
最小供电电压:3.135 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:MATTE TIN
端子形式:J BEND端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:11.505 mmuPs/uCs/外围集成电路类型:CLOCK GENERATOR, OTHER
Base Number Matches:1

84329BV-01LFT 数据手册

 浏览型号84329BV-01LFT的Datasheet PDF文件第10页浏览型号84329BV-01LFT的Datasheet PDF文件第11页浏览型号84329BV-01LFT的Datasheet PDF文件第12页浏览型号84329BV-01LFT的Datasheet PDF文件第14页浏览型号84329BV-01LFT的Datasheet PDF文件第15页浏览型号84329BV-01LFT的Datasheet PDF文件第16页 
ICS84329B-01  
700MHZ, LOW JITTER, CRYSTAL-TO-3.3V  
DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER  
Integrated  
Circuit  
Systems, Inc.  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS84329B-01.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS84329B-01 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 140mA = 485mW  
Power (outputs)MAX = 30mW/Loaded Output pair  
Total Power_MAX (3.465V, with all outputs switching) = 485mW + 30mW = 515mW  
2. JunctionTemperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device.The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = JunctionTemperature  
θJA = Junction-to-AmbientThermal Resistance  
Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)  
TA = AmbientTemperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a  
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 31.1°C/W perTable 8A below.  
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:  
70°C + 0.515W * 31.1°C/W = 86°C. This is well below the limit of 125°C.  
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
TABLE 8A. THERMAL RESISTANCE θJA FOR 28-PIN PLCC, FORCED CONVECTION  
θJA byVelocity (Linear Feet per Minute)  
0
200  
500  
Multi-Layer PCB, JEDEC Standard Test Boards  
37.8°C/W  
31.1°C/W  
28.3°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
TABLE 8B. THERMAL RESISTANCE θJA FOR 28-PIN SOIC, FORCED CONVECTION  
θJA byVelocity (Linear Feet per Minute)  
0
200  
60.8°C/W  
39.7°C/W  
500  
53.2°C/W  
36.8°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
76.2°C/W  
46.2°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
84329BM-01  
www.icst.com/products/hiperclocks.html  
REV. A JUNE 10, 2005  
13  

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