是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | TFBGA, BGA64,11X11,20 | 针数: | 64 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.71 |
Is Samacsys: | N | 系列: | 83840 |
JESD-30 代码: | S-PBGA-B64 | JESD-609代码: | e3 |
长度: | 7 mm | 逻辑集成电路类型: | MULTIPLEXER |
功能数量: | 10 | 输入次数: | 10 |
输出次数: | 1 | 端子数量: | 64 |
最高工作温度: | 70 °C | 最低工作温度: | |
输出特性: | 3-STATE | 输出极性: | TRUE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装等效代码: | BGA64,11X11,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5 V | 传播延迟(tpd): | 0.25 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Other Logic ICs | 最大供电电压 (Vsup): | 2.7 V |
最小供电电压 (Vsup): | 2.3 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 温度等级: | COMMERCIAL |
端子面层: | MATTE TIN | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 7 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
83840BHT | IDT |
获取价格 |
Logic Circuit, PBGA64 |
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8384-5 | MOLEX |
获取价格 |
Conductor Punch |
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8384-6 | MOLEX |
获取价格 |
Conductor Anvil |
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8384-7 | MOLEX |
获取价格 |
Insulation Punch |
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8384-8 | MOLEX |
获取价格 |
Insulation Anvil |
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83852C | MURATA |
获取价格 |
Toroidal Surface Mount Power Inductors |
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8385A01 | LUMBERG |
获取价格 |
Multimodul™-Steckverbinder, Raster 2,5 mm |
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83-875 | AMPHENOL |
获取价格 |
RF UHF Connector, 1 Contact(s), Female, Panel Mount, Solder Terminal, Locking, Receptacle |
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83-875-1002 | AMPHENOL |
获取价格 |
RF UHF Connector, Female, Panel Mount, Solder Terminal, Receptacle |
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83-876 | AMPHENOL |
获取价格 |
RF UHF Connector, Female, Panel Mount, Solder Terminal, Receptacle |
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