75730-0112

更新时间： 2024-01-01 08:30:14

品牌	Logo	应用领域
莫仕 - MOLEX		连接器电源连接器
页数	文件大小	规格书
2页	160K
描述
Micro-Max Power™ High-Current Header

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技术参数
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75730-0112 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.84
Is Samacsys：	N	连接器类型：	RECTANGULAR POWER CONNECTOR
联系完成配合：	NOT SPECIFIED	触点材料：	NOT SPECIFIED
Base Number Matches：	1

75730-0112 数据手册

4.00mm (.157”) Pitch

Micro-Max Power™

High-Current Header

FEATURES AND SPECIFICATIONS

Low-proﬁle, high-current Micro-Max Power

header provides versatile solutions in a

compact design

75730 Board-to-Board

Designed for high-current density applications,

Molex’s Micro-Max Power header is soldered directly

to PCBs such as a Voltage Regulator Module (VRM) or

a mother- board using a slotted via. With a current

rating of 16.0A per blade at 30°C T-rise, Micro-Max

Power may be used in any board-to-board application

where power transfer is needed through a non-

separable interface in a compact design.

Left to right: 7, 10, and 15 circuit versions

Micro-Max Power headers are available in circuit

sizes ranging from 4 to 24 blades in a single-row

conﬁguration. Optional voided circuits are available, to

allow for use in high-voltage applications.

Features and Beneﬁts

n 4.17mm (.164“) connector height off the PCB, the

n Compact size improves airﬂow and saves PCB space

low-proﬁle design enhances system airﬂow

n Optional voided circuits with design ﬂexibility for

high-voltage applications

n Non-separable interface allows for higher current

and greater density capability with lower resistance

plane-to-plane compared to similar products with

separable interfaces or standard stick headers

n Two blade lengths available to accommodate 1.57

to 2.36mm (.050 to .093”) PCB thicknesses

SPECIFICATIONS

Reference Information

Packaging: Tray

UL File No.: E29179

Designed In: USA

Physical

Housing: LCP

Contact: Copper (Cu) Alloy

Plating:

Solder Tail Area – 100µ” Tin (Sn)

Underplating – 50µ” Nickel (Ni) overall

PCB Thickness:

Mother board – 1.57 to 3.18mm (.062 to .125”)

Daughter Card – 1.27 to 2.36mm (.050 to .093”)

Operating Temperature: -40 to +105°C

Electrical

Voltage: 250V

Current: 16.0A at 30°C T-rise

Insulation Resistance: 5000 Megohms min.

Mechanical

Terminal Retention: 7.78 N (1.75 lbs) min.

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与75730-0112相关器件

型号	品牌	描述	获取价格	数据表
75730-0113	MOLEX	4.00mm (.157") EXTreme MicroPower Header, 13 Circuits, 3.06mm (.120") Tail Length	获取价格
75730-0114	MOLEX	Micro-Max Power™ High-Current Header	获取价格
75730-0115	MOLEX	4.00mm (.157) EXTreme MicroPower™ Header, 15	获取价格
75730-0116	MOLEX	Micro-Max Power™ High-Current Header	获取价格
75730-0117	MOLEX	4.00mm (.157) EXTreme MicroPower™ Header, 17	获取价格
75730-0118	MOLEX	Micro-Max Power™ High-Current Header	获取价格