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75465-2204 PDF预览

75465-2204

更新时间： 2024-11-24 06:31:59
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器PC
页数 文件大小 规格书
3页 292K
描述
1.85 by 1.85mm (.073 by .073”) Pitch GbX* Backplane Connector System in 2, 3, 4 and 5-Pair Columns

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75465-2204 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：ObsoleteReach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8536.69.40.40
风险等级：5.84Is Samacsys：N
其他特性：PANEL MOUNTABLE主体宽度：0.976 inch
主体长度：2.068 inch连接器类型：BOARD CONNECTOR
联系完成配合：NOT SPECIFIED触点性别：MALE
触点材料：NOT SPECIFIED触点模式：RECTANGULAR
触点电阻：10 m ΩDIN 符合性：NO
介电耐压：750VDC V耐用性：200 Cycles
滤波功能：NOIEC 符合性：NO
绝缘电阻：1000000000 Ω绝缘体颜色：GRAY
绝缘体材料：GLASS FILLED LIQUID CRYSTAL POLYMERMIL 符合性：NO
插接触点节距：0.073 inch混合触点：NO
安装选项1：GUIDE PIN安装选项2：LOCKING
安装方式：STRAIGHT安装类型：BOARD
连接器数：ONEPCB行数：11
装载的行数：11最高工作温度：105 °C
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
电镀厚度：30u inch极化密钥：POLARIZED HOUSING
额定电流（信号）：1 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子长度：0.091 inch端子节距：1.85 mm
端接类型：PRESS FIT触点总数：275
UL 易燃性代码：94V-0Base Number Matches：1

75465-2204 数据手册

 浏览型号75465-2204的Datasheet PDF文件第2页浏览型号75465-2204的Datasheet PDF文件第3页 
1.85 by 1.85mm  
Features and speciFications  
(.073 by .073”) pꢀꢁꢂh GbX*  
Bꢃꢂkꢄlꢃꢅꢆ cꢇꢅꢅꢆꢂꢁꢇꢈ syꢉꢁꢆm  
ꢀꢅ 2, 3, 4 ꢃꢅꢊ 5-pꢃꢀꢈ cꢇlꢋmꢅꢉ  
2 ꢃꢅꢊ 3 cꢇlꢋmꢅꢉ:  
75650, 75370 dꢀffꢆꢈꢆꢅꢁꢀꢃl  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75670, 75660 Lꢀꢁꢆ dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75676, 75666 Hybꢈꢀꢊ dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75827, 75433 Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl  
Hꢆꢃꢊꢆꢈꢉ  
75861, 75649 Lꢀꢁꢆ Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl  
Hꢆꢃꢊꢆꢈꢉ  
75492, 75331 Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ  
Top, left to right: 75360, 75220, 75370, 75650. Bottom, left to right: 75237, 75235, 75433, 75827  
2 and 3-Pair Columns add to Molex’s GbX Backplane Interconnect System Offering, Delivering  
Speeds Up To 10 Gbps, High Density (Up to 69 Mated Differential Channels Per Inch) and is  
Custom Configurable  
4 ꢃꢅꢊ 5 cꢇlꢋmꢅꢉ:  
75220, 75360 dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
Data rates up to 10 Gbps may now be achieved with  
the GbX 2 and 3-pair column daughtercard and  
backplane system. The 2 and 3-pair column system  
completes the GbX product offering, making it a  
complete solution for high-end telecommunication and  
datacommunication applications.  
solution in the near term, but also by its electrical  
performance in upgradeable systems. Speeds of 10  
Gbps have been demonstrated with appropriate SERDES  
(Serializer/ Deserializer) devices and board-material  
selection. This allows system architects freedom-of-  
design for faster future systems without the worry of  
backward compatibility, along with the economy of a  
common backplane for two generations of equipment.  
75420  
4-pꢃꢀꢈ Lꢀꢁꢆ  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
4-pꢃꢀꢈ Hybꢈꢀꢊ  
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ  
aꢉꢉꢆmblꢀꢆꢉ  
75426  
The GbX connector system provides the speed,  
density, and low-applied cost required by leading-  
edge backplane applications. It is especially suited  
for designs that require future speed upgrades by  
daughtercard replacement into an existing backplane.  
In addition, the GbX Lite Series system provides a  
complimentary high-density open pin field for cost-  
effective design of slower-speed circuits along the same  
75235, 75237 Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl  
Hꢆꢃꢊꢆꢈꢉ  
With native differential signaling speeds up to 10 Gbps, stiffener as the standard, high-speed GbX wafers. For  
75465  
4-pꢃꢀꢈ Lꢀꢁꢆ Bꢃꢂkꢄlꢃꢅꢆ  
sꢀgꢅꢃl Hꢆꢃꢊꢆꢈ  
GbX is well suited for existing and future generations  
of XAUI (10 Gigabit Attachment Unit Interface) and  
InfiniBand† based systems, in addition to those based  
on ATCA‡ (Advanced Telecom Computing Architecture)  
and OIF (Optical Internetworking Forum) chip  
protocols.  
more information on Molex’s extensive GbX offering,  
please visit: www.molex.com/product/backplan/gbx.  
html.  
75341, 75510 Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ  
*GbX and VHDM-HSD are registered trademarks of Amphenol  
Corporation  
†InfiniBand is a registered trademark of the InfiniBand Trade  
Association  
‡ATCA is a trademark of the PCI Industrial Manufacturers  
Group  
sꢁꢃꢅꢊ-alꢇꢅꢆ Gꢋꢀꢊꢆ pꢀꢅ Kꢀꢁ:  
75234  
Internetworking and telecommunication equipment  
engineers will benefit by the GbX connector’s ability  
to provide not only a high-density, low applied-cost  
Features and Benefits  
n
n
n
Up to 69 real differential pairs per linear inch (27  
Modular daughtercard components with GbX  
L-Series available with custom, cost-effective  
receptacle assemblies  
Data rate options up to 10 Gbps are able to support  
future daughtercard speed upgrades  
real differential pairs per 10.00mm (.393”) offers  
high density with more differential pairs per linear  
inch than VHDM-HSD*  
n
Optimized differential pair contacts for easier  
board trace routing  
n
Bifurcated contact beams in daughtercard  
receptacle provide greater reliability with two  
points of contact to header pin  
123

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