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74LVT574_08 PDF预览

74LVT574_08

更新时间: 2024-09-25 12:23:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器
页数 文件大小 规格书
11页 349K
描述
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

74LVT574_08 数据手册

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January 2008  
74LVT574, 74LVTH574  
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs  
Features  
General Description  
Input and output interface capability to systems at  
The LVT574 and LVTH574 are high-speed, low-power  
octal D-type flip-flop featuring separate D-type inputs for  
each flip-flop and 3-STATE outputs for bus-oriented  
applications. A buffered Clock (CP) and Output Enable  
(OE) are common to all flip-flops.  
5V V  
CC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH574),  
also available without bushold feature (74LVT574)  
Live insertion/extraction permitted  
The LVTH574 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Power Up/Down high impedance provides glitch-free  
bus loading  
Outputs source/sink –32mA/+64mA  
Functionally compatible with the 74 series 574  
Latch-up performance exceeds 500mA  
ESD performance:  
These octal flip-flops are designed for low-voltage (3.3V)  
V
applications, but with the capability to provide a TTL  
CC  
interface to a 5V environment. The LVT574 and  
LVTH574 are fabricated with an advanced BiCMOS  
technology to achieve high speed operation similar to 5V  
ABT while maintaining a low power dissipation.  
– Human-body model > 2000V  
– Machine model > 200V  
– Charged-device model > 1000V  
Ordering Information  
Package  
Order Number Number  
Package Description  
74LVT574WM  
74LVT574SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LVT574MSA  
74LVT574MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
74LVTH574WM  
74LVTH574SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LVTH574MSA  
74LVTH574MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
©1999 Fairchild Semiconductor Corporation  
74LVT574, 74LVTH574 Rev. 1.6.0  
www.fairchildsemi.com  

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