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74LCX374_08 PDF预览

74LCX374_08

更新时间: 2024-09-30 12:51:31
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飞兆/仙童 - FAIRCHILD 触发器
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15页 671K
描述
74LCX374 Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

74LCX374_08 数据手册

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February 2008  
74LCX374  
Low Voltage Octal D-Type Flip-Flop  
with 5V Tolerant Inputs and Outputs  
Features  
General Description  
5V tolerant inputs and outputs  
The LCX374 consists of eight D-type flip-flops featuring  
separate D-type inputs for each flip-flop and 3-STATE  
outputs for bus-oriented applications. A buffered clock  
(CP) and Output Enable (OE) are common to all flip-  
flops. The LCX374 is designed for low voltage appli-  
cations with capability of interfacing to a 5V signal  
environment.  
2.3V–3.6V V specifications provided  
CC  
8.5ns t max (V = 3.3V), 10µA I max  
PD  
CC  
CC  
Power-down high impedance inputs and outputs  
(1)  
Supports live insertion/withdrawal  
24mA output drive (V = 3.0V)  
CC  
Implements proprietary noise/EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance  
The LCX374 is fabricated with an advanced CMOS  
technology to achieve high speed operation while main-  
taining CMOS low power dissipation.  
– Human Body Model > 2000V  
– Machine Model > 200V  
Leadless DQFN package  
Note:  
1. To ensure the high impedance state during power up  
or down, OE should be tied to V through a pull-up  
CC  
resistor: the minimum value of the resistor is  
determined by the current-sourcing capability of the  
driver.  
Ordering Information  
Package  
Order Number  
Number  
Package Description  
74LCX374WM  
M20B  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300"  
Wide  
74LCX374SJ  
M20D  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
(2)  
74LCX374BQX  
MLP20B  
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),  
JEDEC MO-241, 2.5 x 4.5mm  
74LCX374MSA  
74LCX374MTC  
Note:  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm  
Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,  
4.4mm Wide  
2. DQFN package available in Tape and Reel only.  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
©2006 Fairchild Semiconductor Corporation  
74LCX374 Rev. 1.6.0  
www.fairchildsemi.com  

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