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74LCX374MTCX-NL PDF预览

74LCX374MTCX-NL

更新时间: 2024-02-26 18:29:42
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器
页数 文件大小 规格书
14页 765K
描述
Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

74LCX374MTCX-NL 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:SOIC
包装说明:SOP, SOP20,.4针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.04
Is Samacsys:N系列:LVC/LCX/Z
JESD-30 代码:R-PDSO-G20JESD-609代码:e3
长度:12.8 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:150000000 Hz
最大I(ol):0.024 A湿度敏感等级:1
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP20,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:8.5 ns传播延迟(tpd):10.5 ns
认证状态:Not Qualified座面最大高度:2.65 mm
子类别:FF/Latches最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE宽度:7.5 mm
Base Number Matches:1

74LCX374MTCX-NL 数据手册

 浏览型号74LCX374MTCX-NL的Datasheet PDF文件第2页浏览型号74LCX374MTCX-NL的Datasheet PDF文件第3页浏览型号74LCX374MTCX-NL的Datasheet PDF文件第4页浏览型号74LCX374MTCX-NL的Datasheet PDF文件第5页浏览型号74LCX374MTCX-NL的Datasheet PDF文件第6页浏览型号74LCX374MTCX-NL的Datasheet PDF文件第7页 
February 2006  
74LCX374  
Low Voltage Octal D-Type Flip-Flop  
with 5V Tolerant Inputs and Outputs  
Features  
General Description  
5V tolerant inputs and outputs  
The LCX374 consists of eight D-type flip-flops featuring  
separate D-type inputs for each flip-flop and 3-STATE  
outputs for bus-oriented applications. A buffered clock  
(CP) and Output Enable (OE) are common to all flip-  
flops. The LCX374 is designed for low voltage appli-  
cations with capability of interfacing to a 5V signal  
environment.  
2.3V–3.6V V specifications provided  
CC  
8.5ns t max (V = 3.3V), 10µA I max  
PD  
CC  
CC  
Power-down high impedance inputs and outputs  
1
Supports live insertion/withdrawal  
±24mA output drive (V = 3.0V)  
CC  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance  
The LCX374 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
– Human Body Model > 2000V  
– Machine Model > 200V  
Leadless Pb-Free DQFN package  
Ordering Information  
Package  
Order Number  
Number  
Package Description  
74LCX374WM  
M20B  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300"  
Wide  
74LCX374SJ  
M20D  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
2
74LCX374BQX  
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads  
(DQFN), JEDEC MO-241, 2.5 x 4.5mm  
74LCX374MSA  
MSA20  
MTC20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm  
Wide  
74LCX374MTC  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,  
4.4mm Wide  
3
74LCX374MTCX_NL  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC  
MO-153, 4.4mm Wide  
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Notes:  
1. To ensure the high impedance state during power up or down, OE should be tied to V through a pull-up resistor: the minimum  
CC  
value of the resistor is determined by the current-sourcing capability of the driver.  
2. DQFN package available in Tape and Reel only.  
3. “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
©2006 Fairchild Semiconductor Corporation  
74LCX374 Rev. 2.0.0  
1
www.fairchildsemi.com  

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