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74HCT1G00GV PDF预览

74HCT1G00GV

更新时间: 2024-01-07 21:40:17
品牌 Logo 应用领域
恩智浦 - NXP 触发器逻辑集成电路光电二极管
页数 文件大小 规格书
16页 75K
描述
2-input NAND gate

74HCT1G00GV 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:TSSOP,针数:5
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.08系列:HCT
JESD-30 代码:R-PDSO-G5JESD-609代码:e3
长度:2 mm逻辑集成电路类型:NAND GATE
湿度敏感等级:1功能数量:1
输入次数:2端子数量:5
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260传播延迟(tpd):27 ns
认证状态:Not Qualified座面最大高度:1.1 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:TIN端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:1.25 mm
Base Number Matches:1

74HCT1G00GV 数据手册

 浏览型号74HCT1G00GV的Datasheet PDF文件第1页浏览型号74HCT1G00GV的Datasheet PDF文件第2页浏览型号74HCT1G00GV的Datasheet PDF文件第3页浏览型号74HCT1G00GV的Datasheet PDF文件第5页浏览型号74HCT1G00GV的Datasheet PDF文件第6页浏览型号74HCT1G00GV的Datasheet PDF文件第7页 
Philips Semiconductors  
Product specification  
2-input NAND gate  
74HC1G00; 74HCT1G00  
RECOMMENDED OPERATING CONDITIONS  
74HC1G  
TYP. MAX. MIN.  
74HCT1G  
UNIT  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
2.0  
TYP. MAX.  
VCC  
VI  
5.0  
6.0  
4.5  
0
5.0  
5.5  
V
V
V
input voltage  
0
VCC  
VCC  
VCC  
VCC  
VO  
output voltage  
0
0
Tamb  
operating ambient  
temperature  
see DC and AC  
characteristics per  
device  
40  
+25  
+125 40  
+25  
+125 °C  
tr,tf  
input rise and fall times VCC = 2.0 V  
VCC = 4.5 V  
1000  
500  
ns  
ns  
ns  
500  
VCC = 6.0 V  
400  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V);  
see note 1 and 2.  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN. MAX. UNIT  
VCC  
IIK  
0.5  
+7.0  
±20  
±20  
V
input diode current  
VI < −0.5 V or VI > VCC + 0.5 V  
mA  
mA  
IOK  
IO  
output diode current  
V
O < −0.5 V or VO > VCC + 0.5 V  
output source or sink current  
VCC or GND current  
0.5 V < VO < VCC + 0.5 V  
±12.5 mA  
±25 mA  
+150 °C  
200 mW  
ICC  
Tstg  
PD  
storage temperature  
65  
power dissipation per package  
for temperature range from 40 to +125 °C;  
note 3  
Notes  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress rating only and  
functional operation of the device at these or any other conditions beyond those under ‘recommended operating  
conditions’ is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device  
reliability.  
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
3. Above 55 °C the value of PD derates linearly with 2.5 mW/K.  
2002 May 15  
4

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