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74HC574BQ PDF预览

74HC574BQ

更新时间: 2023-09-03 20:29:00
品牌 Logo 应用领域
安世 - NEXPERIA /
页数 文件大小 规格书
17页 284K
描述
Octal D-type flip-flop; positive edge-trigger; 3-stateProduction

74HC574BQ 数据手册

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74HC574; 74HCT574  
Octal D-type flip-flop; positive edge-trigger; 3-state  
Rev. 9 — 20 October 2022  
Product data sheet  
1. General description  
The 74HC574; 74HCT574 is an 8-bit positive-edge triggered D-type flip-flop with 3-state outputs.  
The device features a clock (CP) and output enable (OE) inputs. The flip-flops will store the state  
of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH  
clock (CP) transition. A HIGH on OE causes the outputs to assume a high-impedance OFF-state.  
Operation of the OE input does not affect the state of the flip-flops. Inputs include clamp diodes.  
This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC  
.
2. Features and benefits  
Wide supply voltage range from 2.0 V to 6.0 V  
CMOS low power dissipation  
High noise immunity  
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B  
Complies with JEDEC standards:  
JESD8C (2.7 V to 3.6 V)  
JESD7A (2.0 V to 6.0 V)  
Input levels:  
For 74HC574: CMOS level  
For 74HCT574: TTL level  
3-state non-inverting outputs for bus oriented applications  
8-bit positive, edge-triggered register  
Common 3-state output enable input  
ESD protection:  
HBM JESD22-A114F exceeds 2 kV  
MM JESD22-A115-A exceeds 200 V  
Specified from -40 °C to +85 °C and from -40 °C to +125 °C  
3. Ordering information  
Table 1. Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74HC574D  
74HCT574D  
-40 °C to +125 °C  
-40 °C to +125 °C  
-40 °C to +125 °C  
SO20  
plastic small outline package; 20 leads;  
body width 7.5 mm  
SOT163-1  
74HC574PW  
74HCT574PW  
TSSOP20  
DHVQFN20  
plastic thin shrink small outline package;  
20 leads; body width 4.4 mm  
SOT360-1  
SOT764-1  
74HC574BQ  
plastic dual in-line compatible thermal  
enhanced very thin quad flat package; no leads;  
20 terminals; body 2.5 × 4.5 × 0.85 mm  
 
 
 

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