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74HC574 PDF预览

74HC574

更新时间: 2024-01-14 11:32:52
品牌 Logo 应用领域
安森美 - ONSEMI 触发器
页数 文件大小 规格书
8页 128K
描述
Octal 3−State Noninverting D Flip−Flop

74HC574 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:TSSOP,
针数:20Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.29
其他特性:BROADSIDE VERSION OF 374系列:HC/UH
JESD-30 代码:R-PDSO-G20JESD-609代码:e4
长度:6.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER湿度敏感等级:1
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:125 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260传播延迟(tpd):45 ns
认证状态:Not Qualified座面最大高度:1.1 mm
最大供电电压 (Vsup):6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:4.4 mm

74HC574 数据手册

 浏览型号74HC574的Datasheet PDF文件第2页浏览型号74HC574的Datasheet PDF文件第3页浏览型号74HC574的Datasheet PDF文件第4页浏览型号74HC574的Datasheet PDF文件第5页浏览型号74HC574的Datasheet PDF文件第6页浏览型号74HC574的Datasheet PDF文件第7页 
74HC574  
Octal 3−State Noninverting  
D Flip−Flop  
HighPerformance SiliconGate CMOS  
The 74HC574 is identical in pinout to the LS574. The device inputs  
are compatible with standard CMOS outputs; with pullup resistors,  
they are compatible with LSTTL outputs.  
Data meeting the setup time is clocked to the outputs with the  
rising edge of the Clock. The Output Enable input does not affect the  
states of the flipflops but when Output Enable is high, all device  
outputs are forced to the highimpedance state. Thus, data may be  
stored even when the outputs are not enabled.  
http://onsemi.com  
MARKING  
DIAGRAMS  
20  
1
HC  
574  
TSSOP20  
DT SUFFIX  
CASE 948E  
20  
The HC574 is identical in function to the HC374A but has the  
flipflop inputs on the opposite side of the package from the outputs to  
facilitate PC board layout.  
ALYW G  
1
G
Features  
HC574 = Device Code  
Output Drive Capability: 15 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2.0 to 6.0 V  
Low Input Current: 1.0 mA  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
A
L
Y
W
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
ESD Performance: HBM > 2000 V; Machine Model > 200 V  
Chip Complexity: 266 FETs or 66.5 Equivalent Gates  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
This is a PbFree Device  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
March, 2007 Rev. 1  
74HC574/D  

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