Datasheet > 74HC541

74HC541

更新时间： 2024-11-18 22:53:15

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
6页	92K
描述
Inverting Octal 3-STATE Buffer Octal 3-STATE Buffer

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中文翻译

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数据手册

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74HC541 数据手册

September 1983

Revised February 1999

MM74HC540 • MM74HC541

Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer

In order to enhance PC board layout, the MM74HC540 and

MM74HC541 offers a pinout having inputs and outputs on

General Description

The MM74HC540 and MM74HC541 3-STATE buffers uti-

opposite sides of the package. All inputs are protected from

lize advanced silicon-gate CMOS technology. They pos-

damage due to static discharge by diodes to V_CCand

sess high drive current outputs which enable high speed

ground.

operation even when driving large bus capacitances.

These circuits achieve speeds comparable to low power

Schottky devices, while retaining the advantage of CMOS

Features

circuitry, i.e., high noise immunity, and low power consump-

tion. Both devices have a fanout of 15 LS-TTL equivalent

inputs.

■ Typical propagation delay: 12 ns

■ 3-STATE outputs for connection to system buses

■ Wide power supply range: 2–6V

The MM74HC540 is an inverting buffer and the

MM74HC541 is a non-inverting buffer. The 3-STATE con-

trol gate operates as a two-input NOR such that if either G1

or G2 are HIGH, all eight outputs are in the high-imped-

ance state.

■ Low quiescent current: 80 µA maximum (74HC Series)

■ Output current: 6 mA

Ordering Code:

Order Number Package Number

Package Description

MM74HC540WM

MM74HC540SJ

MM74HC540MTC

MM74HC540N

M20B

M20D

MTC20

N20A

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MM74HC541WM

MM74HC541SJ

MM74HC541MTC

MM74HC541N

M20B

M20D

MTC20

N20A

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagrams

Pin Assignments for DIP, SOIC, SOP and TSSOP

Top View

MM74HC540

Top View

MM74HC541

DS005341.prf

www.fairchildsemi.com

12 3 4 5 6

中文翻译

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与74HC541相关器件

型号	品牌	获取价格	描述	数据表
74HC541D	NXP	获取价格	Octal buffer/line driver; 3-state
74HC541D	NEXPERIA	获取价格	Octal buffer/line driver; 3-stateProduction
74HC541D	TOSHIBA	获取价格	Not Recommended for New Design
74HC541D,652	NXP	获取价格	74HC(T)541 - Octal buffer/line driver; 3-state SOP 20-Pin
74HC541D/T3	NXP	获取价格	IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SOP-20, Bus Driver/Transceive
74HC541DB	NXP	获取价格	Octal buffer/line driver 3-state
74HC541DB,118	NXP	获取价格	74HC(T)541 - Octal buffer/line driver; 3-state SSOP2 20-Pin
74HC541D-Q100	NEXPERIA	获取价格	Octal buffer/line driver; 3-state
74HC541D-T	NXP	获取价格	Octal buffer/line driver; 3-state
74HC541N	NXP	获取价格	Octal buffer/line driver; 3-state

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