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74AHC1GU04DBVTE4 PDF预览

74AHC1GU04DBVTE4

更新时间： 2024-01-20 01:14:45
品牌 Logo 应用领域
德州仪器 - TI 栅极触发器逻辑集成电路光电二极管
页数 文件大小 规格书
12页 469K
描述
SINGLE INVERTER GATE

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中文翻译

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74AHC1GU04DBVTE4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOT-23
包装说明：LSSOP, TSOP5/6,.11,37针数：5
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.26系列：AHC/VHC/H/U/V
JESD-30 代码：R-PDSO-G5JESD-609代码：e4
长度：2.9 mm逻辑集成电路类型：INVERTER
最大I（ol）：0.008 A湿度敏感等级：1
功能数量：1输入次数：1
端子数量：5最高工作温度：85 °C
最低工作温度：-40 °C输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：LSSOP
封装等效代码：TSOP5/6,.11,37封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, LOW PROFILE, SHRINK PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：260电源：2/5.5 V
Prop。Delay @ Nom-Sup：8 ns传播延迟（tpd）：12 ns
认证状态：Not Qualified施密特触发器：NO
座面最大高度：1.45 mm子类别：Gates
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2 V
标称供电电压 (Vsup)：3.3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.95 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：1.6 mm
Base Number Matches：1

74AHC1GU04DBVTE4 数据手册

 浏览型号74AHC1GU04DBVTE4的Datasheet PDF文件第2页浏览型号74AHC1GU04DBVTE4的Datasheet PDF文件第3页浏览型号74AHC1GU04DBVTE4的Datasheet PDF文件第4页浏览型号74AHC1GU04DBVTE4的Datasheet PDF文件第6页浏览型号74AHC1GU04DBVTE4的Datasheet PDF文件第7页浏览型号74AHC1GU04DBVTE4的Datasheet PDF文件第8页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Oct-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
74AHC1GU04DBVRE4  
74AHC1GU04DBVRG4  
74AHC1GU04DBVTE4  
74AHC1GU04DBVTG4  
74AHC1GU04DCKRE4  
74AHC1GU04DCKRG4  
74AHC1GU04DCKTE4  
74AHC1GU04DCKTG4  
74AHC1GU04DRLRG4  
SN74AHC1GU04DBVR  
SN74AHC1GU04DBVT  
SN74AHC1GU04DCKR  
SN74AHC1GU04DCKT  
SN74AHC1GU04DRLR  
SOT-23  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DRL  
DBV  
DBV  
DCK  
DCK  
DRL  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SC70  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SC70  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
Addendum-Page 1  
12345678...12

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74AHC1GU04DBVTE4 替代型号

型号 品牌 替代类型 描述 数据表
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