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73K224L-IH PDF预览

73K224L-IH

更新时间: 2024-02-26 15:04:53
品牌 Logo 应用领域
东电化 - TDK 调制解调器电信集成电路
页数 文件大小 规格书
32页 208K
描述
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem

73K224L-IH 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:22
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.04其他特性:FULL DUPLEX
数据速率:2.4 MbpsJESD-30 代码:R-PDIP-T22
长度:27.686 mm功能数量:1
端子数量:22最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
座面最大高度:5.08 mm标称供电电压:5 V
表面贴装:NO电信集成电路类型:MODEM
温度等级:INDUSTRIAL端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
宽度:10.16 mmBase Number Matches:1

73K224L-IH 数据手册

 浏览型号73K224L-IH的Datasheet PDF文件第24页浏览型号73K224L-IH的Datasheet PDF文件第25页浏览型号73K224L-IH的Datasheet PDF文件第26页浏览型号73K224L-IH的Datasheet PDF文件第28页浏览型号73K224L-IH的Datasheet PDF文件第29页浏览型号73K224L-IH的Datasheet PDF文件第30页 
73K224L  
V.22bis/V.22/V.21/Bell 212A/Bell 103  
Single-Chip Modem  
CRYSTAL OSCILLATOR  
MODEM PERFORMANCE CHARACTERISTICS  
The K-Series crystal oscillator requires a parallel mode  
(antiresonant) crystal which operates at 11.0592 MHz.  
It is important that this frequency be maintained to  
within ±0.01% accuracy.  
The curves presented here define modem IC  
performance under a variety of line conditions  
while inducing disturbances that are typical of  
those encountered during data transmission on  
public service telephone lines. Test data was  
taken using an AEA Electronics’ “Autotest I”  
modem test set and line simulator, operating  
under computer control. All tests were run full-  
duplex, using a Hayes SmartModemÔ 2400 as  
the reference modem. A 511 pseudo-random-bit  
pattern was used for each data point. Noise was  
C-message weighted and all signal-to-noise (S/N)  
ratios reflect total power measurements similar to  
the CCITT V.56 measurement specification. The  
individual tests are defined as follows.  
In order for a parallel mode crystal to operate correctly  
and to specification, it must have a load capacitor  
connected to the junction of each of the crystal and  
internal inverter connections, terminated to ground.  
The values of these capacitors depend primarily on the  
crystal’s characteristics, and to a lesser degree on the  
internal inverter circuit. The values used affect the  
accuracy and start up characteristics of the oscillator.  
LAYOUT CONSIDERATIONS  
Good analog/digital design rules must be used to  
control system noise in order to obtain highest  
performance in modem designs. The more digital  
circuitry present on the PC board, the more this  
attention to noise control is needed. The modem  
should be treated as a high impedance analog device.  
A 22 µF electrolytic capacitor in parallel with a 0.22 µF  
ceramic capacitor between VDD and GND is  
recommended. Liberal use of ground planes and  
larger traces on power and ground are also highly  
favored. The ISET resistor and capacitor should be  
mounted near the ISET pin, away from digital signals.  
High speed digital circuits tend to generate  
BER vs. S/N  
This test measures the ability of the modem to  
operate over noisy lines with a minimum of data-  
transfer errors. Since some noise is generated in  
the best of dial-up lines, the modem must operate  
with the lowest S/N ratio possible. Better modem  
performance is indicated by test curves that are  
closest to the BER axis. A narrow spread between  
curves representing the four line parameters  
indicates minimal variation in performance while  
operating over a range of aberrant operating  
conditions. Typically, a modem will exhibit better  
BER-performance test curves receiving in the low  
band than in the high band.  
a
significant  
amount  
of  
EMI  
(Electro-Magnetic  
Interference) which must be minimized in order to  
meet regulatory agency limitations. To accomplish this,  
high speed digital devices should be locally bypassed,  
and the telephone line interface and K-Series device  
should be located close to each other near the area of  
the board where the phone line connection is  
accessed. To avoid problems, power supply and  
ground traces should be routed separately to the  
analog and digital functions on the board, and digital  
signals should not be routed near low level or high  
impedance analog traces. The analog and digital  
grounds should only connect at one point near the K-  
Series device ground pin to avoid ground loops. The  
K-Series modem IC’s should have both high frequency  
and low frequency bypassing as close to the package  
as possible.  
BER vs. Receive Level  
This test measures the dynamic range of the  
modem. Because signal levels vary widely over  
dial-up lines, the widest possible dynamic range is  
desirable. The minimum Bell specification calls for  
36 dB of dynamic range. S/N ratios are held  
constant at the indicated values while the receive  
level is lowered from a very high to very low signal  
levels. The width of the “bowl” of these curves,  
taken at the BER point, is the measure of dynamic  
range.  
27  

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