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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 73944-0000 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73944-0002 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73944-0003 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73944-0004 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73944-0005 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73944-0016 | MOLEX |
获取价格 |
Board Connector, 72 Contact(s), 6 Row(s), Male, Straight, 0.079 inch Pitch, Solder Termina |
|
| 73944-0017 | MOLEX |
获取价格 |
2.00mm (.079") Pitch HDM® Board-to-Board Back |
|
| 73944-0104 | MOLEX |
获取价格 |
Board Connector, 72 Contact(s), 6 Row(s), Male, Straight, 0.079 inch Pitch, Solder Termina |
|
| 73944-0112 | MOLEX |
获取价格 |
Board Connector, 72 Contact(s), 6 Row(s), Male, Straight, 0.079 inch Pitch, Solder Termina |
|
| 73944-0117 | MOLEX |
获取价格 |
Board Connector, 72 Contact(s), 6 Row(s), Male, Straight, 0.079 inch Pitch, Solder Termina |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
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AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
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