2.00mm (.079") Pitch
HDM*
FEATURES AND SPECIFICATIONS
Features and Benefits
Electrical
15A per blade current carrying capacity
Female on backplane for safety
3 mating lengths for live insertion
12mm module can be distributed between signal modules
as needed
Current: 15.0A
Board-to-Board
Dielectric Withstanding Voltage: 1000V
Insulation Resistance: 1000 MΩ min.
Daughterboard Power Module
Mechanical
Insertion Force: 55N max. per press-fit pin
Retention Force: 15N min. per press-fit pin
Mating Force: 2.5N max. per contact
Unmating Force: 0.15N min.
Normal Force: 1.0N min.
Integral stiffener combines signal, power and guidance
modules
Metric connector in Futurebus form factor
Surface Mount Compatible
73651
Right Angle
3-Blade Module
Durability: 250 cycles
Reference Information
Product Specification: PS-73651-1998
Packaging: Tube
UL File No.: E29179
Mates With: 73656
Physical
Housing: Liquid crystal polymer
Contact: Blades—0.5mm thick Copper
Receptacle—0.4mm Beryllium Copper Alloy
Plating: 30µ" Gold
Designed In: Millimeters
Operating Temperature: -55 to +105˚C
CATALOG DRAWING (FOR REFERENCE ONLY)
J
0.71
.028
0.838
DIA plated thru hole TYP
DIA drilled hole
0.0330
Note: Solder tail version shown
ORDERING INFORMATION AND DIMENSIONS
Module
Termination
Solder Tail
Solder Tail
Solder Tail
Solder Tail
Solder Tail
Solder Tail
Press-Fit
Order No.
73651-0033
73651-0133
73651-0233
73651-0333
73651-0433
73651-0XXX
73651-1XXX
Dimension P
2.00 (.079)
2.50 (.098)
3.00 (.118)
3.50 (.138)
4.00 (.157)
Contact Molex
3.50 (.138)
Application Note: Connectors are Ordered as Part of an Assembly, Not Individually
The HDM and HDMPLUS daughtercard connectors are composed of modules. The complete
connector with a number of modules, stiffener and hold-downs is given a specific part number
so that a user only needs to order one connector. We show the individual modules in this
catalog, but they are always delivered as completed connectors on a stiffener. On the customer
print for the stiffener is the complete PCB footprint showing holes for signal and power
contacts, plus appropriate mounting holddown features. Most customers use solder-to-board
versions of the RA receptacles, but press-fit RA receptacles are an option.
Daughter Card
Power Module
* High Density Metric and HDMPLUS are trademarks of Teradyne, Inc.
Note: The versions listed here have 3 mating levels: M1-short, M2-medium and M3-long, please contact Molex for
more information
MX01
J-31