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70V7599S133BFG8 PDF预览

70V7599S133BFG8

更新时间: 2024-02-11 10:08:17
品牌 Logo 应用领域
艾迪悌 - IDT 时钟静态存储器内存集成电路
页数 文件大小 规格书
22页 748K
描述
Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208

70V7599S133BFG8 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:BGA, BGA208,17X17,32Reach Compliance Code:compliant
HTS代码:8542.32.00.41风险等级:5.74
最长访问时间:4.2 ns其他特性:PIPELINED OR FLOW THROUGH ARCHITECTURE
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
JESD-30 代码:S-PBGA-B208内存密度:4718592 bit
内存集成电路类型:DUAL-PORT SRAM内存宽度:36
功能数量:1端口数量:2
端子数量:208字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA208,17X17,32封装形状:SQUARE
封装形式:GRID ARRAY并行/串行:PARALLEL
电源:2.5/3.3,3.3 V认证状态:Not Qualified
最大待机电流:0.03 A最小待机电流:3.15 V
子类别:SRAMs最大压摆率:0.645 mA
最大供电电压 (Vsup):3.45 V最小供电电压 (Vsup):3.15 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOMBase Number Matches:1

70V7599S133BFG8 数据手册

 浏览型号70V7599S133BFG8的Datasheet PDF文件第2页浏览型号70V7599S133BFG8的Datasheet PDF文件第3页浏览型号70V7599S133BFG8的Datasheet PDF文件第4页浏览型号70V7599S133BFG8的Datasheet PDF文件第6页浏览型号70V7599S133BFG8的Datasheet PDF文件第7页浏览型号70V7599S133BFG8的Datasheet PDF文件第8页 
IDT70V7599S  
High-Speed 128K x 36 Synchronous Bank-Switchable Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
PinNames  
Left Port  
Right Port  
Names  
Chip Enables  
CE0L  
,
CE1L  
CE0R, CE1R  
R/W  
OE  
BA0L - BA5L  
0L - A10L  
I/O0L - I/O35L  
CLK  
PL/FT  
ADS  
CNTEN  
REPEAT  
BE0L - BE3L  
L
R/W  
OE  
BA0R - BA5R  
0R - A10R  
I/O0R - I/O35R  
CLK  
PL/FT  
ADS  
CNTEN  
REPEAT  
BE0R - BE3R  
R
Read/Write Enable  
Output Enable  
Bank Address(4)  
L
R
A
A
Address  
Data Input/Output  
Clock  
L
R
L
R
Pipeline/Flow-Through  
Address Strobe Enable  
Counter Enable  
Counter Repeat(3)  
Byte Enables (9-bit bytes)  
Power (I/O Bus) (3.3V or 2.5V)(1)  
L
R
L
R
NOTES:  
1. VDD, OPTX, and VDDQX must be set to appropriate operating levels prior to  
applying inputs on the I/Os and controls for that port.  
L
R
2. OPTX selects the operating voltage levels for the I/Os and controls on that port.  
If OPTX is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V  
levels and VDDQX must be supplied at 3.3V. If OPTX is set to VIL (0V), then that  
port's I/Os and address controls will operate at 2.5V levels and VDDQX must be  
supplied at 2.5V. The OPT pins are independent of one another—both ports can  
operate at 3.3V levels, both can operate at 2.5V levels, or either can operate  
at 3.3V with the other at 2.5V.  
V
DDQL  
V
DDQR  
(1,2)  
OPT  
L
OPTR  
Option for selecting VDDQX  
Power (3.3V)(1)  
V
V
DD  
SS  
Ground (0V)  
3. When REPEATX is asserted, the counter will reset to the last valid address loaded  
via ADSX.  
TDI  
TDO  
TCK  
Test Data Input  
4. Accesses by the ports into specific banks are controlled by the bank address  
pins under the user's direct control: each port can access any bank of memory  
with the shared array that is not currently being accessed by the opposite port  
(i.e., BA0L - BA5L BA0R - BA5R). In the event that both ports try to access the  
same bank at the same time, neither access will be valid, and data at the two  
specific addresses targeted by the ports within that bank may be corrupted (in  
the case that either or both ports are writing) or may result in invalid output (in  
the case that both ports are trying to read).  
Test Data Output  
Test Logic Clock (10MHz)  
Test Mode Select  
Reset (Initialize TAP Controller)  
TMS  
TRST  
5626 tbl 01  
6.42  
5

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