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6P8A

更新时间: 2024-01-04 11:48:31
品牌 Logo 应用领域
日电电子 - NEC 微控制器遥控远程控制
页数 文件大小 规格书
95页 815K
描述
MOS INTEGRATED CIRCUIT 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION

6P8A 数据手册

 浏览型号6P8A的Datasheet PDF文件第89页浏览型号6P8A的Datasheet PDF文件第90页浏览型号6P8A的Datasheet PDF文件第91页浏览型号6P8A的Datasheet PDF文件第92页浏览型号6P8A的Datasheet PDF文件第94页浏览型号6P8A的Datasheet PDF文件第95页 
µPD6P8, 6P8A, 6P8B  
NOTES FOR CMOS DEVICES  
1
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN  
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the  
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may  
malfunction. Take care to prevent chattering noise from entering the device when the input level is  
fixed, and also in the transition period when the input level passes through the area between VIL (MAX)  
and VIH (MIN).  
HANDLING OF UNUSED INPUT PINS  
2
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is  
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS  
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed  
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or  
GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins  
must be judged separately for each device and according to related specifications governing the device.  
3
PRECAUTION AGAINST ESD  
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and  
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as  
much as possible, and quickly dissipate it when it has occurred. Environmental control must be  
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that  
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static  
container, static shielding bag or conductive material. All test and measurement tools including work  
benches and floors should be grounded. The operator should be grounded using a wrist strap.  
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for  
PW boards with mounted semiconductor devices.  
4
STATUS BEFORE INITIALIZATION  
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power  
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does  
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the  
reset signal is received. A reset operation must be executed immediately after power-on for devices  
with reset functions.  
5
POWER ON/OFF SEQUENCE  
In the case of a device that uses different power supplies for the internal operation and external  
interface, as a rule, switch on the external power supply after switching on the internal power supply.  
When switching the power supply off, as a rule, switch off the external power supply and then the  
internal power supply. Use of the reverse power on/off sequences may result in the application of an  
overvoltage to the internal elements of the device, causing malfunction and degradation of internal  
elements due to the passage of an abnormal current.  
The correct power on/off sequence must be judged separately for each device and according to related  
specifications governing the device.  
6
INPUT OF SIGNAL DURING POWER OFF STATE  
Do not input signals or an I/O pull-up power supply while the device is not powered. The current  
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and  
the abnormal current that passes in the device at this time may cause degradation of internal elements.  
Input of signals during the power off state must be judged separately for each device and according to  
related specifications governing the device.  
Data Sheet U17848EJ3V0DS  
93  

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