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67095-003 PDF预览

67095-003

更新时间: 2024-11-26 10:03:11
品牌 Logo 应用领域
安费诺 - AMPHENOL /
页数 文件大小 规格书
1页 62K
描述
Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, 0.098 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle

67095-003 数据手册

  
7
5
20.0  
67095−063 /  
67095−062 /  
67095−061 /  
67095−060 /  
67095−059 /  
67095−058 /  
67095−063LF  
67095−062LF  
67095−061LF  
67095−060LF  
67095−059LF  
67095−058LF  
7
6
67095−098/ 67095−098LF  
67095−097/ 67095−097LF  
67095−094/ 67095−094LF  
67095−093/ 67095−093LF  
67095−092/ 67095−092LF  
67095−091/ 67095−091LF  
67095−090/ 67095−090LF  
PART NO:  
15  
14  
13  
12  
11  
10  
9
67095−089 / 67095−089LF  
67095−088 / 67095−088LF  
67095−087 / 67095−087LF  
67095−086 / 67095−086LF  
67095−085 / 67095−085LF  
67095−084 / 67095−084LF  
67095−083 / 67095−083LF  
67095−082 / 67095−082LF  
67095−081 / 67095−081LF  
67095−080 / 67095−080LF  
67095−079 / 67095−079LF  
67095−078 / 67095−078LF  
67095−077 / 67095−077LF  
67095−076 / 67095−076LF  
67095−075 / 67095−075LF  
67095−074 / 67095−074LF  
67095−073 / 67095−073LF  
20.0  
17.5  
15.0  
7.5  
40.0  
37.5  
35.0  
32.5  
30.0  
27.5  
25.0  
22.5  
20.0  
17.5  
15.0  
NOTE  
3
MATERIAL:  
15.0  
52.5  
50.0  
47.5  
45.0  
42.5  
1.HOUSING : PBT 15% GLASS FILLED ,UL94V0 BLACK.  
THE HOUSING WILL WITHSTAND EXPOSURE TO 260−265°C FOR 3.5 SECONDS  
20  
19  
18  
17  
16  
5
IN A WAVE SOLDERING APPLICATION.  
2.PIN : BRASS  
2
4
14  
3
37.5  
10.0  
5
PLATING :  
3. 2 MICRON MIN SnPb OVER 1.27 MICRON MIN. NICKEL UNDER COAT(FOR LEADED VERSION)  
2 MICRON MIN MATTE TIN OVER 1.27 MICRON MIN. NICKEL UNDER COAT(FOR LEAD FREE VERSION)  
4. 0.5 MICRON MIN Au OVER 1.27 MICRON MIN. NICKEL  
67095−057 / 67095−057LF  
67095−020 /  
4
12.5  
52.5  
50.0  
47.5  
45.0  
42.5  
40.0  
37.5  
35.0  
32.5  
30.0  
27.5  
25.0  
22.5  
20.0  
17.5  
15.0  
12.5  
10.0  
7.5  
5
5. 0.3 MICRON MIN Au OVER 1.27 MICRON MIN. NICKEL  
6. POLARIZED HEADER SPECIFIED POSITION DOSE NOT HAVE PIN AS SHOWN  
* 67095−097 .........4TH FROM RIGHT  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
POS DIM X  
PLATING  
8
67095−020LF  
67095−019 / 67095−019LF  
67095−018 / 67095−018LF  
67095−017 / 67095−017LF  
67095−016 / 67095−016LF  
67095−015 / 67095−015LF  
67095−014 / 67095−014LF  
67095−013 / 67095−013LF  
67095−012 / 67095−012LF  
67095−011 / 67095−011LF  
67095−010 / 67095−010LF  
67095−009 / 67095−009LF  
67095−008 / 67095−008LF  
67095−007 / 67095−007LF  
67095−006 / 67095−006LF  
67095−005 / 67095−005LF  
67095−004 / 67095−004LF  
67095−003 / 67095−003LF  
7
6
LEFT  
RIGHT  
* 67095−098 .........2ND FROM RIGHT  
5
8. OPERATING TEMPERATURE  
9. MECHANICAL PERFORMANCE  
DURABILITY (MATING CYCLES)  
GOLD  
TIN−LEAD  
CONTACT RETENTION − 1.5 KG  
10. ELECTRICAL PERFORMANCE  
: −25°C TO +85°C  
4
12.5  
10.0  
3
: 50  
: 20  
2
7.5  
WITHSTANDING VOLTAGE  
INSULATION RESISTANCE  
CURRENT RATING  
: 750 V  
20  
52.5  
: 500MWmin  
: 2 amp DC  
: 20m Wmax  
19 50.0  
18 47.5  
CONTACT RESISTANCE  
3
67095−072 / 67095−072LF 17 45.0  
16 42.5  
15 40.0  
13 35.0  
67095−071 / 67095−071LF  
67095−070 / 67095−070LF  
67095−069 / 67095−069LF  
A
8
4
7
6
67095−068 / 67095−068LF 12 32.5  
5
11 30.0  
10 27.5  
67095−067 / 67095−067LF  
67095−066 / 67095−066LF  
67095−065 / 67095−065LF  
4
3
9
8
25.0  
22.5  
2
67095−002 / 67095−002LF  
PART NO:  
67095−064 / 67095−064LF  
PART NO:  
POS DIM X  
POS DIM X  
PLATING  
PLATING  
1.LF Products meet European Union Directives and other country  
Regulations as described in GS−22−008.  
+0.3  
−0.2  
A
2.The Housing will withstand exposure to 260° peak temperature for  
3.5 sec in a wave solder application with a 1.6mm Min thick circuitboard.  
SECTION−AA  
3.Lead Free or ROHS Directive labelling to be provided as per GS−14−920  
for Lead Free version.  
RELIMATE  
±0.13  
P
I06-0123  
I07-0039  
HVN 2006-07-20  
HVN 2007-03-16  
R
(R/A)  
0°±2°  
MINI K VANDANATH 2003-04-14  
Hiran V N  
HIRAN V N  
HIRAN V N  
2003-04-14  
2007-03-16  
2007-03-16  
67095  
R
1
6
PDM: Rev:R  
STATUS:Released  
Printed: Feb 20, 2010.  

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