是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8536.90.40.00 | 风险等级: | 5.72 |
其他特性: | DIP SOCKET | 主体宽度: | 0.7 inch |
主体深度: | 0.098 inch | 主体长度: | 2.5 inch |
联系完成配合: | GOLD (30) OVER NICKEL | 联系完成终止: | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
触点材料: | NOT SPECIFIED | 触点样式: | RND PIN-SKT |
目前评级: | 1 A | 设备插槽类型: | IC SOCKET |
使用的设备类型: | DIP50 | 介电耐压: | 1000VAC V |
外壳材料: | GLASS FILLED POLYETHYLENE POLYESTER | 绝缘电阻: | 10000000000 Ω |
JESD-609代码: | e0 | 插接触点节距: | 0.1 inch |
安装方式: | STRAIGHT | 触点数: | 50 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
PCB接触模式: | RECTANGULAR | PCB触点行间距: | 0.6 mm |
端子节距: | 2.54 mm | 端接类型: | SOLDER |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
614-93-650-31-007000 | MILL-MAX |
获取价格 |
IC Socket, DIP50, 50 Contact(s), | |
614-93-650-31-012 | PREDIP |
获取价格 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail | |
614-93-650-31-012 | MILL-MAX |
获取价格 |
IC Socket, DIP50, 50 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder, | |
614-93-650-31-012000 | MILL-MAX |
获取价格 |
IC Socket, DIP50, 50 Contact(s), | |
614-93-650-31-018 | MILL-MAX |
获取价格 |
IC Socket, DIP50, 50 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder, | |
614-93-650-31-018000 | MILL-MAX |
获取价格 |
IC Socket, DIP50, 50 Contact(s), | |
614-93-650-41-001 | PREDIP |
获取价格 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail | |
614-93-652-31-007 | MILL-MAX |
获取价格 |
IC Socket, DIP52, 52 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder | |
614-93-652-31-012 | PREDIP |
获取价格 |
Dual-in-line pin carrier assemblies Low profile / low profile ultra thin Solder tail | |
614-93-652-31-012 | MILL-MAX |
获取价格 |
IC Socket, DIP52, 52 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder, |