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59629857501NXB PDF预览

59629857501NXB

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
赛灵思 - XILINX /
页数 文件大小 规格书
22页 169K
描述
QML High-Reliability FPGAs

59629857501NXB 数据手册

 浏览型号59629857501NXB的Datasheet PDF文件第16页浏览型号59629857501NXB的Datasheet PDF文件第17页浏览型号59629857501NXB的Datasheet PDF文件第18页浏览型号59629857501NXB的Datasheet PDF文件第19页浏览型号59629857501NXB的Datasheet PDF文件第20页浏览型号59629857501NXB的Datasheet PDF文件第22页 
R
QPRO XQ4000XL Series QML High-Reliability FPGAs  
Ordering Information  
Example for QPROmilitary temperature part:  
XQ 4062XL -3 PG 475 M  
Mil-PRF-38535  
(QML) Processed  
Temperature Range  
o
o
M = Military Ceramic (T = 55 C to +125 C)  
C
N = Military Plastic (T = 55°C to +125°C)  
J
Device Type  
XQ4085XL  
XQ4062XL  
XQ4036XL  
XQ4013XL  
Number of Pins  
Speed Grade  
Package Type  
CB = Top Brazed Ceramic Quad Flat Pack  
PG = Ceramic Pin Grid Array  
PQ/HQ = Plastic Quad Flat Back  
BG = Plastic Ball Grid Array  
-3  
-1 (XQ4085XL only)  
Example for SMD part:  
5962 98511 01 Q X C  
Generic Standard  
Microcircuit Drawing (SMD)  
Prefix  
Lead Finish  
C = Gold  
B = Solder  
Device Type  
XQ4013XL = 98513  
XQ4036XL = 98510  
XQ4062XL = 98511  
XQ4085XL = 99575  
Package Type  
X = Pin Grid  
Y = Ceramic Quad Flat Pack (Base Mark)  
Z = Ceramic Quad Flat Pack (Lid Mark)  
T = Plastic Quad Flat Pack  
U = Plastic Ball Grid  
Speed Grade  
01 = -3 for XQ4103XL/4036XL/4062XL  
01 = -1 for XQ4085XL  
Q = QML Certified  
N = QML Plastic (N - Grade)  
Revision History  
The following table shows the revision history for this document  
Date  
Version  
1.0  
Description  
05/01/98  
01/01/99  
02/09/00  
06/25/00  
Original document release.  
1.1  
Addition of new packages, clarification of parameters.  
1.2  
Addition of XQ4085XL-1 speed grade part.  
1.3  
Updated timing specifications to match with commercial data sheet. Updated format.  
DS029 (v1.3) June 25, 2000  
www.xilinx.com  
21  
Product Specification  
1-800-255-7778  

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