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5962-9958501QXC PDF预览

5962-9958501QXC

更新时间: 2024-02-26 09:59:09
品牌 Logo 应用领域
ACTEL 可编程逻辑
页数 文件大小 规格书
217页 1554K
描述
Field Programmable Gate Array, 36000 Gates, 2414-Cell, CMOS, CQFP256, CERAMIC, QFP-256

5962-9958501QXC 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:CERAMIC, QFP-256Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.39.00.01
风险等级:5.81其他特性:ALSO OPERATES AT 5V SUPPLY
JESD-30 代码:S-CQFP-F256长度:36 mm
等效关口数量:36000端子数量:256
最高工作温度:125 °C最低工作温度:-55 °C
组织:36000 GATES封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:GQFF封装形状:SQUARE
封装形式:FLATPACK, GUARD RING峰值回流温度(摄氏度):NOT SPECIFIED
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Qualified
筛选级别:MIL-PRF-38535 Class Q座面最大高度:3.18 mm
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:36 mmBase Number Matches:1

5962-9958501QXC 数据手册

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MIL-PRF-38535K  
INDEX  
PARAGRAPH  
Self audit  
A.4.9.2.1  
A.4.9.3.7  
A.4.9.3.8  
A.4.9.3.1  
A.4.9.3.6  
A.4.9.3.2  
A.4.9.1  
A.4.9.3.1.4  
3.3.3  
Self audit areas  
Self audit checklist  
Self audit program  
Self audit report  
Self audit representatives  
Self audit requirements  
Self audit schedule and frequency  
Self-assessment program  
Self-audit requirements  
A.4.9  
Serialization  
A.3.6.8  
B.3.7  
Serialization  
Single lot sampling method  
Solderability  
D.4.2  
3.10  
Solderability  
A.4.2  
SPC and in process monitoring program  
SPC and in process monitoring program  
Specifications, standards, and handbooks  
Specifications, standards, and handbooks  
Specifications, standards, and handbooks  
Specifications, standards, and handbooks  
Specifications, standards, and handbooks  
Specifications, standards, and handbooks  
H.3.2.2.1  
H.3.2.1.3.1  
2.2.1  
A.2.2.1  
C.2.2.1  
F.2.2.1  
H.2.2.1  
J.2.2.1  
D.4  
STATISTICAL SAMPLING PROCEDURES AND TABLE  
Status report  
G.3.2.3  
6.4.45  
Storage temperature  
Subject term (key word) listing  
6.7  
Substrate (of a microcircuit or integrated circuit)  
6.4.3  
Substrate (of a microcircuit or integrated circuit)  
Symbols  
A.3.1.3.3  
D.3.2  
TABLE A-I. Testing guidelines for changes identified as major  
Table A-I.  
Table A-II.  
TABLE A-II. Lead finish systems  
TABLE A-III. Coating thickness and composition  
requirements  
Table A-III.  
TABLE A-IV. Package element (other than leads/terminals)  
finish systems  
Table A-IV.  
Table A-IX  
Table A-V.  
Table A-VI.  
Table A-VII.  
Table A-VIII.  
Table A-X.  
TABLE A-IX. Application specific microcircuits  
TABLE A-V. Lead finish  
TABLE A-VI. Digital microcircuits  
TABLE A-VII. Linear microcircuits  
TABLE A-VIII. Other microcircuits  
TABLE A-X. Quality assurance program requirements  
199  
 

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