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5962-9958501Q9A PDF预览

5962-9958501Q9A

更新时间: 2024-02-19 16:33:09
品牌 Logo 应用领域
ACTEL 可编程逻辑
页数 文件大小 规格书
217页 1554K
描述
Field Programmable Gate Array, 36000 Gates, 2414-Cell, CMOS, DIE-253

5962-9958501Q9A 技术参数

生命周期:Transferred包装说明:DIE-253
Reach Compliance Code:unknown风险等级:5.81
其他特性:ALSO OPERATES AT 5V SUPPLYJESD-30 代码:R-XUUC-N253
JESD-609代码:e0等效关口数量:36000
输入次数:202逻辑单元数量:2414
输出次数:202端子数量:253
最高工作温度:125 °C最低工作温度:-55 °C
组织:36000 GATES封装主体材料:UNSPECIFIED
封装代码:DIE封装等效代码:DIE OR CHIP
封装形状:RECTANGULAR封装形式:UNCASED CHIP
电源:3.3/5 V可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class Q
子类别:Field Programmable Gate Arrays最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:TIN LEAD
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

5962-9958501Q9A 数据手册

 浏览型号5962-9958501Q9A的Datasheet PDF文件第5页浏览型号5962-9958501Q9A的Datasheet PDF文件第6页浏览型号5962-9958501Q9A的Datasheet PDF文件第7页浏览型号5962-9958501Q9A的Datasheet PDF文件第9页浏览型号5962-9958501Q9A的Datasheet PDF文件第10页浏览型号5962-9958501Q9A的Datasheet PDF文件第11页 
MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
A.4.5.4.1 Group C sample selection............................................................................................................................81  
A.4.5.4.1.1 Microcircuit group assignments ................................................................................................................81  
A.4.5.4.1.2 Product acceptable for delivery.................................................................................................................81  
A.4.5.5 Group D inspection.........................................................................................................................................81  
A.4.5.5.1 Group D sample selection............................................................................................................................84  
A.4.5.5.2 Incoming vendor material control program...................................................................................................84  
A.4.5.6 Group E inspection .........................................................................................................................................84  
A.4.5.6.1 Group E sample selection............................................................................................................................84  
A.4.5.7 End-point tests for groups B, C, and D (and E if applicable) inspections........................................................84  
A.4.5.8 Nonconformance ............................................................................................................................................85  
A.4.5.8.1 Group B failure.............................................................................................................................................85  
A.4.5.8.2 Alternate group B failure..............................................................................................................................85  
A.4.5.8.3 Group C failure ............................................................................................................................................86  
A.4.5.8.4 Group D failure ............................................................................................................................................86  
A.4.6 Screening...........................................................................................................................................................86  
A.4.6.1 Burn-in............................................................................................................................................................86  
A.4.6.1.1 Lots and sublots resubmitted for burn-in......................................................................................................86  
A.4.6.1.2 Burn-in acceptance criteria ..........................................................................................................................87  
A.4.6.1.2.1 Failure analysis of burn-in screen failures for class level S devices .........................................................87  
A.4.6.2 External visual screen.....................................................................................................................................87  
A.4.6.3 Particle impact noise detection (PIND) test for class level S devices .............................................................87  
A.4.6.4 Lead forming...................................................................................................................................................87  
A.4.6.5 Nondestructive bond pull test for class level S devices...................................................................................87  
A.4.7 Test results ........................................................................................................................................................88  
A.4.7.1 Screening test data for class level S microcircuits..........................................................................................88  
A.4.8 Quality assurance program................................................................................................................................88  
A.4.8.1 Manufacturer certification................................................................................................................................88  
A.4.8.1.1 Design, processing, manufacturing, and testing instructions.......................................................................89  
A.4.8.1.1.1 Conversion of customer requirements into manufacturer's internal instructions.......................................89  
A.4.8.1.1.2 Personnel training and testing ..................................................................................................................89  
A.4.8.1.1.3 Inspection of incoming materials and utilities, and of work in-process......................................................89  
A.4.8.1.1.4 Quality control operations .........................................................................................................................89  
A.4.8.1.1.5 Quality assurance operations ...................................................................................................................89  
A.4.8.1.1.6 Design, processing, manufacturing equipment, and materials instructions...............................................91  
A.4.8.1.1.7 Cleanliness and atmosphere control in work areas ..................................................................................91  
A.4.8.1.1.8 Design, material, and process change control..........................................................................................91  
A.4.8.1.1.9 Tool, gauge, and test equipment maintenance and calibration.................................................................91  
A.4.8.1.1.10 Failure and defect analysis and feedback...............................................................................................92  
A.4.8.1.1.11 Corrective action and evaluation.............................................................................................................92  
A.4.8.1.1.12 Incoming, in-process, and outgoing inventory control.............................................................................92  
A.4.8.1.1.13 Schematics .............................................................................................................................................92  
A.4.8.1.1.14 ESD handling control program................................................................................................................92  
A.4.8.1.2 Records to be maintained............................................................................................................................92  
A.4.8.1.2.1 Personnel training and testing ..................................................................................................................94  
A.4.8.1.2.1.1 Training of operators and inspectors......................................................................................................94  
A.4.8.1.2.2 Inspection operations................................................................................................................................94  
A.4.8.1.2.3 Failure and defect reports and analyses...................................................................................................94  
A.4.8.1.2.4 Initial documentation and subsequent changes in design, materials, or processing.................................94  
A.4.8.1.2.5 Equipment calibrations..............................................................................................................................95  
A.4.8.1.2.6 Process, utility, and material controls........................................................................................................95  
A.4.8.1.2.7 Product lot identification............................................................................................................................95  
A.4.8.1.2.8 Product traceability ...................................................................................................................................95  
A.4.8.1.3 Quality assurance program plan..................................................................................................................95  
A.4.8.1.3.1 Functional block organization chart ..........................................................................................................96  
A.4.8.1.3.2 Examples of manufacturing flowchart.......................................................................................................96  
viii  

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