MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
A.3.1.3.3 Substrate (of a microcircuit or integrated circuit)..........................................................................................49
A.3.1.3.4 Integrated circuit (microcircuit).....................................................................................................................49
A.3.1.3.4.1 Multichip microcircuit.................................................................................................................................49
A.3.1.3.4.2 Hybrid microcircuit ....................................................................................................................................49
A.3.1.3.4.3 Monolithic microcircuit (or integrated circuit).............................................................................................49
A.3.1.3.4.4 Film microcircuit (or film integrated circuit)................................................................................................49
A.3.1.3.5 Microcircuit module......................................................................................................................................49
A.3.1.3.6 Production lot...............................................................................................................................................50
A.3.1.3.7 Inspection lot - class level S.........................................................................................................................50
A.3.1.3.8 Inspection lot - class level B.........................................................................................................................50
A.3.1.3.9 Inspection sublot - class level S...................................................................................................................50
A.3.1.3.10 Inspection lot split - class level B ...............................................................................................................50
A.3.1.3.11 Wafer lot ....................................................................................................................................................50
A.3.1.3.12 Package type.............................................................................................................................................50
A.3.1.3.13 Microcircuit group ......................................................................................................................................50
A.3.1.3.14 Percent defective allowable (PDA) ............................................................................................................50
Delta limit (∆)
A.3.1.3.15
.............................................................................................................................................50
A.3.1.3.16 Rework.......................................................................................................................................................51
A.3.1.3.17 Final seal ...................................................................................................................................................51
A.3.1.3.18 Acquiring activity........................................................................................................................................51
A.3.1.3.19 Qualifying activity.......................................................................................................................................51
A.3.1.3.20 Device type................................................................................................................................................51
A.3.1.3.21 Die type......................................................................................................................................................51
A.3.1.3.22 Antistatic ....................................................................................................................................................51
A.3.1.3.23 Conductive.................................................................................................................................................51
A.3.1.3.24 Insulating ...................................................................................................................................................51
A.3.1.3.25 Dissipative .................................................................................................................................................51
A.3.1.3.26 Radiation hardness assurance (RHA)........................................................................................................51
A.3.1.3.27 Electrostatic discharge (ESD) sensitivity....................................................................................................51
A.3.1.3.28 Custom microcircuit ...................................................................................................................................52
A.3.1.3.29 Die family...................................................................................................................................................52
A.3.1.3.30 Package family ..........................................................................................................................................52
A.3.1.3.31 Military operating temperature range.........................................................................................................52
A.3.1.3.32 Process monitor.........................................................................................................................................52
A.3.1.3.33 Device specification...................................................................................................................................52
A.3.1.3.34 Class level B..............................................................................................................................................52
A.3.1.3.35 Class level S..............................................................................................................................................52
A.3.2 Item requirements..............................................................................................................................................52
A.3.2.1 Electrical test requirements.............................................................................................................................52
A.3.2.2 Alternate die/fabrication requirements ............................................................................................................53
A.3.2.2.1 Example C of C............................................................................................................................................53
A.3.2.2.2 Die evaluation requirements ........................................................................................................................54
A.3.3 Classification of requirements............................................................................................................................54
A.3.3.1 Certification of conformance and acquisition traceability ................................................................................55
A.3.4 Quality assurance requirements ........................................................................................................................56
A.3.4.1 Qualification....................................................................................................................................................56
A.3.4.1.1 Compliance validation..................................................................................................................................56
A.3.4.1.2 Process monitor programs...........................................................................................................................56
A.3.4.1.2.1 Inspection by scanning electron microscope (SEM) .................................................................................56
A.3.4.1.2.2 Wire bonding.............................................................................................................................................56
A.3.4.1.2.3 Die attachment..........................................................................................................................................56
A.3.4.1.2.4 Lid seal .....................................................................................................................................................56
A.3.4.1.2.5 Particle detection ......................................................................................................................................56
A.3.4.1.2.6 Lead trimming and final lead finish thickness............................................................................................57
A.3.4.1.3 Qualification to RHA levels ..........................................................................................................................57
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