R
QPRO™ XQ4000XL Series QML High-Reliability FPGAs
XQ4000XL RAM Synchronous (Edge-Triggered) Write Operation Guidelines
Testing of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%
functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are
representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the
static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist. All timing
parameters assume worst-case operating conditions (supply voltage and junction temperature). Values apply to all
XQ4000XL devices and are expressed in nanoseconds unless otherwise noted.
Speed Grade
Size Symbol
-3
-1
Single Port RAM
Units
Min
Max
Min
Max
Write Operation
Address write cycle time (clock K period)
16x2
32x1
T
T
9.0
9.0
7.7
7.7
ns
ns
WCS
WCTS
Clock K pulse width (active edge)
Address setup time before clock K
Address hold time after clock K
DIN setup time before clock K
DIN hold time after clock K
WE setup time before clock K
WE hold time after clock K
16x2
32x1
T
T
4.5
4.5
3.9
3.9
ns
ns
WPS
WPTS
16x2
32x1
T
T
2.2
2.2
1.7
1.7
ns
ns
ASS
ASTS
16x2
32x1
T
T
0
0
0
0
ns
ns
AHS
AHTS
16x2
32x1
T
T
2.0
2.5
1.7
2.1
ns
ns
DSS
DSTS
16x2
32x1
T
T
0
0
0
0
ns
ns
DHS
DHTS
16x2
32x1
T
T
2.0
1.8
1.6
1.5
ns
ns
WSS
WSTS
16x2
32x1
T
T
0
0
0
0
ns
ns
WHS
WHTS
Data valid after clock K
16x2
32x1
T
T
6.8
8.1
5.8
6.9
ns
ns
WOS
WOTS
Read Operation
Address read cycle time
16x2
32x1
T
T
4.5
6.5
2.6
3.8
ns
ns
RC
RCT
Data Valid after address change (no Write Enable)
Address setup time before clock K
16x2
32x1
T
T
1.6
2.7
1.3
2.2
ns
ns
ILO
IHO
16x2
32x1
T
T
1.3
2.3
0.9
1.7
ns
ns
ICK
IHCK
6
DS029 (v1.2) February 9, 2000